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Microsystem Technologies

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01-08-2013 | Technical Paper

Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Authors: Nguyen Van Toan, Hidetoshi Miyashita, Masaya Toda, Yusuke Kawai, Takahito Ono

Published in: Microsystem Technologies | Issue 8/2013

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Abstract

The design, fabrication and packaging process of silicon resonators capable of the integration of LSI (Large Scale Integration) have been developed on the basis of packaging technology using an LTCC (Low Temperature Co-fired Ceramic) substrate. The structures of silicon resonators are defined by deep reactive ion etching (DRIE) on a silicon on insulator (SOI) wafer and then transferred onto the LTCC substrate and hermetically sealed by anodic bonding technique. The measured resonant frequency of a micromechanical bulk acoustic mode silicon resonator after packaging at 0.02 Pa is 20.24 MHz with a quality factor of 50,600.

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Title: Fabrication of an hermetically packaged silicon resonator on LTCC substrate
Authors: Nguyen Van Toan
Hidetoshi Miyashita
Masaya Toda
Yusuke Kawai
Takahito Ono
Publication date: 01-08-2013
Publisher: Springer Berlin Heidelberg
Published in: Microsystem Technologies / Issue 8/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-012-1716-5

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