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2018 | OriginalPaper | Chapter

7. FOWLP: Chip-Last or RDL-First

Author : John H. Lau

Published in: Fan-Out Wafer-Level Packaging

Publisher: Springer Singapore

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Abstract

Since 2006, NEC Electronics Corporation (now Renesas Electronics Corporation) has been developing a novel SMAFTI (SMArt chip connection with feedthrough interposer) packaging technology for inter-chip wideband data transfer, 3D stacked memory integrated on logic devices, system in wafer-level package (SiWLP), and “RDL-first” fan-out wafer-level packaging. In this chapter, three RDL (redistribution layer) fabrication methods for chip-last FOWLP (fan-out wafer-level packaging) are briefly mentioned.

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previous chapter FOWLP: Chip-First and Die Face-Up

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Title: FOWLP: Chip-Last or RDL-First
Author: John H. Lau
Publisher: Springer Singapore
Book: Fan-Out Wafer-Level Packaging
Print ISBN: 978-981-10-8883-4

Electronic ISBN: 978-981-10-8884-1

Copyright Year: 2018
DOI: https://doi.org/10.1007/978-981-10-8884-1_7