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Journal of Electronic Materials
Published in: Journal of Electronic Materials 1/2020

31-07-2019 | TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples

Authors: Thiago Soares, Clarissa Cruz, Bismarck Silva, Crystopher Brito, Amauri Garcia, José Eduardo Spinelli, Noé Cheung

Published in: Journal of Electronic Materials | Issue 1/2020

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Metadata
Title
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
Authors
Thiago Soares
Clarissa Cruz
Bismarck Silva
Crystopher Brito
Amauri Garcia
José Eduardo Spinelli
Noé Cheung
Publication date
31-07-2019
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 1/2020
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-019-07454-6

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