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Journal of Electronic Materials
Published in: Journal of Electronic Materials 1/2020

03-10-2019 | TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

Authors: André M. Delhaise, Polina Snugovsky, Jeff Kennedy, David Hillman, Ivan Matijevic, Stephan Meschter, David Adams, Milea Kammer, Marianne Romansky, Joseph Juarez, Ivan Straznicky, Leonid Snugovsky, Ross Wilcoxon, Doug D. Perovic

Published in: Journal of Electronic Materials | Issue 1/2020

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Metadata
Title
Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys
Authors
André M. Delhaise
Polina Snugovsky
Jeff Kennedy
David Hillman
Ivan Matijevic
Stephan Meschter
David Adams
Milea Kammer
Marianne Romansky
Joseph Juarez
Ivan Straznicky
Leonid Snugovsky
Ross Wilcoxon
Doug D. Perovic
Publication date
03-10-2019
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 1/2020
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-019-07666-w

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