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Published in: Journal of Materials Science: Materials in Electronics 8/2019

13-03-2019

Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles

Authors: Wei Liu, Yiping Wang, Zhen Zheng, Chunqing Wang, Rong An, Yanhong Tian, Lingchao Kong, Ronglin Xu

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2019

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Abstract

In order to obtain Ag nanoparticles (NPs) sintered Cu–Cu joints with better mechanical properties in a relative short time and under a suitable pressure, a laser sintering process and a novel paste prepared by mixed Ag NPs (19 and 62 nm in diameters) were utilized and studied. The results indicated that joints with low porosities were fabricated within 15 s’ laser irradiation. By increasing laser power and sintering time, shear strength of the joints increased obviously. Shear strength of joints with 30% (mass ratio) 62 nm NPs was the highest and could reach 32 MPa when the samples were sintered at 60 W for 15 s under 5 MPa. The enhanced mechanical properties of the joints could be attributed to small NPs that could fill pores between larger NPs and improve initial packing density of the mixed particles. The results indicated that the mixed pastes had excellent potentials as alternative die-attach materials for high temperature power device applications.

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Metadata
Title
Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles
Authors
Wei Liu
Yiping Wang
Zhen Zheng
Chunqing Wang
Rong An
Yanhong Tian
Lingchao Kong
Ronglin Xu
Publication date
13-03-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01094-6

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