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Microsystem Technologies
Published in: Microsystem Technologies 9-11/2008

01-10-2008 | Technical Paper

Measurement of side walls of high aspect ratio microstructures

Authors: M. Simon, E. Reznikova, V. Nazmov, A. Last

Published in: Microsystem Technologies | Issue 9-11/2008

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Abstract

In this paper, the new method of measurements is presented for the technological control of the lithographic fabrication of high aspect ratio microstructures with complex side-wall profiles. The sampling procedure includes pouring polymer glue on a substrate with the microstructures and its hardening, sectioning the polymer matrix in the depth with planes parallel to the substrate and analysis of digital optical microscope images of the planes. The measured deviations the micro structure profiles in comparison with the designed geometry are used for the further optimization of the technological design of planar X-ray refractive lenses.
previous article Submicron polymer structures with X-ray lithography and hot embossing
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Literature
Nazmov V, Reznikova E, Somogyi A, Mohr J, Saile V (2004) Proc Soc Photo Opt Instrum Eng 5539:235–243
Simon M (2006) Diploma thesis, Forschungszentrum Karlsruhe, Institute for Microstructure Technology, Methoden zur Charakterisierung von SU-8 Röntgenlinsen
Metadata
Title
Measurement of side walls of high aspect ratio microstructures
Authors
M. Simon
E. Reznikova
V. Nazmov
A. Last
Publication date
01-10-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 9-11/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-008-0618-z

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