Microscale molding replication of Cu- and Ni-based structures

Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.