Published in: Open Access 01-01-2008 Mechanical Size Effects in Miniaturized Lead-Free Solder Joints Authors: Peter Zimprich, Usman Saeed, Agnieszka Betzwar-Kotas, Brigitte Weiss, Herbert Ipser Published in: Journal of Electronic Materials | Issue 1/2008 Read the PDF-Version of this Article. loading … previous article Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration next article Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging download DOWNLOAD print PRINT