Issue 1/2008
Content (18 Articles)
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hu Hao, Yaowu Shi, Zhidong Xia, Yongping Lei, Fu Guo
Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications
Jong-Woong Kim, Young-Chul Lee, Seung-Boo Jung
Tin Whisker Growth Induced by High Electron Current Density
Y. W. Lin, Yi-Shao Lai, Y. L. Lin, Chun-Te Tu, C. R. Kao
Modeling Material Properties of Lead-Free Solder Alloys
Zhanli Guo, Nigel Saunders, Peter Miodownik, Jean-Philippe Schillé
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
Tina Ventura, Christopher M. Gourlay, Kazuhiro Nogita, Tetsuro Nishimura, Michel Rappaz, Arne K. Dahle
Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
C.M. Gourlay, J. Read, K. Nogita, A.K. Dahle
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging
K.K. Hong, J.B. Ryu, C.Y. Park, J.Y. Huh
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
Yee-Wen Yen, Weng-Ting Chou, Yu Tseng, Chiapyng Lee, Chun-Lei Hsu
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park, Jeong-Won Yoon, Seung-Boo Jung, Cheol-Woong Yang
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration
Y.L. Lin, Y.S. Lai, Y.W. Lin, C.R. Kao
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints
Peter Zimprich, Usman Saeed, Agnieszka Betzwar-Kotas, Brigitte Weiss, Herbert Ipser
Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
Yun-Hwan Jo, Joo Won Lee, Sun-Kyoung Seo, Hyuck Mo Lee, Hun Han, Dong Chun Lee
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows
Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee, Jong-Woong Kim, Dae-Up Kim, Jeong-Hoon Moon, Seung-Boo Jung
Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature
Dong-Xia Xu, Yong-Ping Lei, Zhi-Dong Xia, Fu Guo, Yao-Wu Shi