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Journal of Materials Science
Published in: Journal of Materials Science 5/2017

01-03-2017 | Original Paper

Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy

Authors: Yu Sun, Haibo Yu, M. Tumerkan Kesim, S. Pamir Alpay, Mark Aindow

Published in: Journal of Materials Science | Issue 5/2017

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Abstract

Ag3Sn and Cu3Sn are important intermetallic compounds formed in lead-free solders and dental amalgams. In this paper, we present a study on the microstructural stability in a Ag1.5Cu1.5Sn alloy using a combination of scanning and transmission electron microscopy experiments. The as-cast microstructure comprises the D0a phases θ-Ag3Sn and ε1-Cu3Sn, plus a small amount of η-Cu6Sn5. There is topotaxial precipitation of Ag3Sn within the Cu3Sn phase, which coarsens with heat treatment at 450 °C. For extended low-temperature aging (1000 h at 100 °C), there is also precipitation of Cu3Sn within the Ag3Sn phase. All the heat-treatments result in the formation of secondary defects in the near-surface region. These defects are dislocations in the Ag3Sn and {011}-type twins in the Cu3Sn. The same defect types are observed in these phases for as-cast samples deformed in compression suggesting that different deformation mechanisms are operating in these isostructural phases.
previous article Comparative study on microstructure and electrical properties of (K0.5Na0.5)NbO3 lead-free ceramics prepared via two different sintering methods
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Footnotes
1
The notation adopted for the phases corresponds to that defined by Chang et al. [36].
 
2
As noted previously [40], the conventions used to define the axes in the D0a and superstructure polymorphs of Cu3Sn are different. The b axis of the D0a structure is denoted c in the long-period superstructure, and the long-period repeat along the b axis of superstructure is approximately ten times the c 0 parameter for the D0a polymorph.
 
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Metadata
Title
Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy
Authors
Yu Sun
Haibo Yu
M. Tumerkan Kesim
S. Pamir Alpay
Mark Aindow
Publication date
01-03-2017
Publisher
Springer US
Published in
Journal of Materials Science / Issue 5/2017
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-016-0590-4

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