Skip to main content
Top

Microsystem Technologies

Issue 11/2023

Content (10 Articles)

MM wave based multiband spider slot patch antenna for 5G and underwater communication

  • Review Paper

Pramod Kumar Aylapogu, Kiran Kumar Gurrala

Image transmission in UWA channel using CS based OTFS system

  • Technical Paper

Avik Kumar Das, Ankita Pramanik

Design, modelling and FEM-based validation of composite membrane circular cMUT cell

  • Technical Paper

Shuvam Gupta, Prateek Kothari, Rishi Sharma, Ravindra Mukhiya

Thermomechanical vibration analysis of a restrained nanobeam

  • Technical Paper

Ömer Civalek, Büşra Uzun, Mustafa Özgür Yaylı

Tunable sensitivity of a waterborne bacteria detector based on a ternary photonic crystal with high-critical-temperature superconductor and semiconductor layers

  • Technical Paper

Abdulkarem H. M. Almawgani, Sofyan A. Taya, Dana N. Alhamss, Ilhami Colak, Shobhit K. Patel, Ahmad Alzahrani

An ultrasensitive micropillar-enabled acoustic wave (μPAW) microdevice for real-time viscosity measurement

  • Open Access
  • Technical Paper

Ilia Chiniforooshan Esfahani, Siqi Ji, Nastaran Alamgir Tehrani, Hongwei Sun

Linear multi-degree of freedom variable stiffness actuator for robotic assembly tasks

  • Technical Paper

Ji Min Baek, Min Guk Han, Ja Choon Koo

Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration

  • Technical Paper

Hyunsik Jeong, Kwangwon Seo, Jinsoo Bae, Gunhee Jang

Premium Partners

    Image Credits
    in-adhesives, MKVS, Ecoclean/© Ecoclean, Hellmich GmbH/© Hellmich GmbH, Krahn Ceramics/© Krahn Ceramics, Kisling AG/© Kisling AG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, Schenker Hydraulik AG/© Schenker Hydraulik AG