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Published in: Journal of Materials Science: Materials in Electronics 10/2014

01-10-2014

Oxygen vacancy induced dielectric relaxation studies in Bi4−xLaxTi3O12 (x = 0.0, 0.3, 0.7, 1.0) ceramics

Authors: Sumit Bhardwaj, Joginder Paul, Subhash Chand, K. K. Raina, Ravi Kumar

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2014

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Abstract

In the present work, oxygen vacancy induced dielectric relaxations were studied for Lanthanum substituted Bi4−xLaxTi3O12 (x = 0.0, 0.3, 0.7, 1.0) ceramics. X-ray diffraction patterns reveal the formation of single phase orthorhombic structure in all the samples. The partial substitutions of lanthanum ions were found to significantly influence the grain morphology of the sintered ceramics. Temperature dependent dielectric measurements indicate a well-defined dielectric constant peak around 150 °C, with strong frequency dispersion. This dielectric anomaly was attributed to the Maxwell–Wagner space charge relaxation phenomenon related to oxygen vacancies. The space charges related to oxygen vacancies were confirmed by annealing the samples in oxidative atmosphere. The electrical modulus analysis shows that the samples exhibit non-Debye type relaxation behavior. Doubly ionized oxygen vacancies were found to influence the relaxation behaviour at higher temperature. The observed dielectric relaxation as a function of temperature and frequency were explained on the basis of oxygen vacancies.

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Literature
1.
go back to reference A. Peláiz-Barrancoa, M.E. Mendozab, F. Calderón-Piñara, O. García-Zaldívara, R. López-Nodac, J. de los Santos-Guerrad, J. Antonio Eirasd, Solid State Commun. 144, 425 (2007)CrossRef A. Peláiz-Barrancoa, M.E. Mendozab, F. Calderón-Piñara, O. García-Zaldívara, R. López-Nodac, J. de los Santos-Guerrad, J. Antonio Eirasd, Solid State Commun. 144, 425 (2007)CrossRef
3.
go back to reference T. Jardiel, A.C. Caballero, M. Villegas, J. Ceram. Soc. Jpn. 116, 511 (2008)CrossRef T. Jardiel, A.C. Caballero, M. Villegas, J. Ceram. Soc. Jpn. 116, 511 (2008)CrossRef
4.
go back to reference C.W. Ahn, H. Lee, S.H. Kang, W. Kim, M.S. Choi, J.S. Lee, H.W. Kim, B.M. Jin, J. Electroceram. 21, 847 (2008)CrossRef C.W. Ahn, H. Lee, S.H. Kang, W. Kim, M.S. Choi, J.S. Lee, H.W. Kim, B.M. Jin, J. Electroceram. 21, 847 (2008)CrossRef
5.
go back to reference K. Ruan, X. Chen, T. Lian, G. Wu, D. Bao, J. Appl. Phys. 103, 074101 (2008)CrossRef K. Ruan, X. Chen, T. Lian, G. Wu, D. Bao, J. Appl. Phys. 103, 074101 (2008)CrossRef
6.
go back to reference K. Ruan, X. Chen, T. Lian, G. Wu, D. Bao, J. Appl. Phys. 103, 086104 (2008)CrossRef K. Ruan, X. Chen, T. Lian, G. Wu, D. Bao, J. Appl. Phys. 103, 086104 (2008)CrossRef
9.
go back to reference J. Zhu, X.B. Chan, W.P. Lu, X.Y. Mao, R. Hui, Appl. Phys. Lett. 83, 1818 (2003)CrossRef J. Zhu, X.B. Chan, W.P. Lu, X.Y. Mao, R. Hui, Appl. Phys. Lett. 83, 1818 (2003)CrossRef
10.
go back to reference A.Z. Simoes, C.S. Riccardi, L.S. Cavalcante, E. Longo, J.A. Varela, B. Mizaikoff, D.W. Hess, J. Appl. Phys. 101, 084112 (2007)CrossRef A.Z. Simoes, C.S. Riccardi, L.S. Cavalcante, E. Longo, J.A. Varela, B. Mizaikoff, D.W. Hess, J. Appl. Phys. 101, 084112 (2007)CrossRef
11.
go back to reference B.H. Park, B.S. Kang, S.D. Bu, T.W. Noh, J. Lee, W. Jo, Nature 401, 682 (1999)CrossRef B.H. Park, B.S. Kang, S.D. Bu, T.W. Noh, J. Lee, W. Jo, Nature 401, 682 (1999)CrossRef
13.
14.
go back to reference Y.Y. Yao, C.H. Song, P. Bao, D. Su, X.M. Lu, J.S. Zhu, Y.N. Wang, J. Appl. Phys. 95, 3126 (2004)CrossRef Y.Y. Yao, C.H. Song, P. Bao, D. Su, X.M. Lu, J.S. Zhu, Y.N. Wang, J. Appl. Phys. 95, 3126 (2004)CrossRef
18.
go back to reference Z. Zhu, K. Jiang, G.J. Davies, G. Li, Q. Yin, S. Sheng, Smar. Mater. Struct. 15, 1249 (2006)CrossRef Z. Zhu, K. Jiang, G.J. Davies, G. Li, Q. Yin, S. Sheng, Smar. Mater. Struct. 15, 1249 (2006)CrossRef
19.
20.
22.
go back to reference Z.Z. Lazarevic, N.Z. Romcevic, J.D. Bobic, M.J. Romcevic, Z. Dohcevic-Mitrovic, B.D. Stojanovic, J. Alloys Compd. 486, 848 (2009)CrossRef Z.Z. Lazarevic, N.Z. Romcevic, J.D. Bobic, M.J. Romcevic, Z. Dohcevic-Mitrovic, B.D. Stojanovic, J. Alloys Compd. 486, 848 (2009)CrossRef
23.
24.
go back to reference Y. Kan, X. Jin, G. Zhang, P. Wang, Y.B. Cheng, D. Yan, J. Mater. Chem. 14, 3566 (2004)CrossRef Y. Kan, X. Jin, G. Zhang, P. Wang, Y.B. Cheng, D. Yan, J. Mater. Chem. 14, 3566 (2004)CrossRef
25.
go back to reference V.B. Santos, J.C. M’Peko, M. Mir, V.R. Mastelaro, A.C. Hernandes, J. Eur. Ceram. Soc. 29, 751 (2009)CrossRef V.B. Santos, J.C. M’Peko, M. Mir, V.R. Mastelaro, A.C. Hernandes, J. Eur. Ceram. Soc. 29, 751 (2009)CrossRef
26.
go back to reference P. Lunkenheimer, V. Bobnar, A.V. Pronin, A.I. Ritus, A.A. Volkov, A. Loidl, Phys. Rev. B 66, 052105 (2002)CrossRef P. Lunkenheimer, V. Bobnar, A.V. Pronin, A.I. Ritus, A.A. Volkov, A. Loidl, Phys. Rev. B 66, 052105 (2002)CrossRef
27.
go back to reference J.C. Maxwell, Electricity and Magnetism (Oxford University Press, Oxford, 1873), vol. 1, sec. 328 J.C. Maxwell, Electricity and Magnetism (Oxford University Press, Oxford, 1873), vol. 1, sec. 328
30.
31.
go back to reference A.H. Elsayed, A.M. Haffz, Egypt. J. Solids 28, 53 (2005) A.H. Elsayed, A.M. Haffz, Egypt. J. Solids 28, 53 (2005)
32.
33.
go back to reference J. Liu, C.G. Duan, W.G. Yin, W.N. Mei, R.W. Smith, J.R. Hardy, J. Chem. Phys. 119, 2812 (2003)CrossRef J. Liu, C.G. Duan, W.G. Yin, W.N. Mei, R.W. Smith, J.R. Hardy, J. Chem. Phys. 119, 2812 (2003)CrossRef
34.
go back to reference S.K. Bera, S.K. Barik, R.N.P. Choudhary, P.K. Bajpai, Bull. Mater. Sci. 35, 47 (2012)CrossRef S.K. Bera, S.K. Barik, R.N.P. Choudhary, P.K. Bajpai, Bull. Mater. Sci. 35, 47 (2012)CrossRef
35.
go back to reference Lily, K. Kumari, K. Prasad, R.N.P. Choudhary, J. Alloys Compd. 453, 325 (2008)CrossRef Lily, K. Kumari, K. Prasad, R.N.P. Choudhary, J. Alloys Compd. 453, 325 (2008)CrossRef
37.
38.
go back to reference S.K. Rout, A. Hussian, J.S. Lee, I.W. Kim, S.I. Woo, J. Alloys Compd. 477, 706 (2009)CrossRef S.K. Rout, A. Hussian, J.S. Lee, I.W. Kim, S.I. Woo, J. Alloys Compd. 477, 706 (2009)CrossRef
Metadata
Title
Oxygen vacancy induced dielectric relaxation studies in Bi4−xLaxTi3O12 (x = 0.0, 0.3, 0.7, 1.0) ceramics
Authors
Sumit Bhardwaj
Joginder Paul
Subhash Chand
K. K. Raina
Ravi Kumar
Publication date
01-10-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2205-7

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