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2018 | OriginalPaper | Chapter

4. Post-Placement Optimization for MP-DSAL Compliant Layout

Authors : Seongbo Shim, Youngsoo Shin

Published in: Physical Design and Mask Synthesis for Directed Self-Assembly Lithography

Publisher: Springer International Publishing

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Abstract

Sub 7-nm technology node requires small contacts whose size and pitch are beyond optical resolution limit. Such fine features can be created by directed self-assembly lithography with multiple patterning (MP-DSAL). In MP-DSAL, layout decomposition is a key problem, in which contacts that are physically close are clustered to form a GP which is then assigned to one of masks. Many practical contact layouts are not MP-DSAL compliant in a sense that layout decomposition is not perfectly performed leaving a few MP coloring conflicts and GPs of non-zero defect probability. This chapter introduces placement optimization to make a layout MP-DSAL compliant. The optimization problem is formulated as ILP, and a practical heuristic is also presented.

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previous chapter Placement Optimization for DSAL
next chapter Redundant Via Insertion for DSAL
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Metadata
Title
Post-Placement Optimization for MP-DSAL Compliant Layout
Authors
Seongbo Shim
Youngsoo Shin
Copyright Year
2018
Book
Physical Design and Mask Synthesis for Directed Self-Assembly Lithography

Print ISBN: 978-3-319-76293-7

Electronic ISBN: 978-3-319-76294-4

Copyright Year: 2018

DOI
https://doi.org/10.1007/978-3-319-76294-4_4

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