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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 18/2021

26-08-2021 | Review

Recent advances on SnBi low-temperature solder for electronic interconnections

Authors: Nan Jiang, Liang Zhang, Li-Li Gao, Xiao-Guo Song, Peng He

Published in: Journal of Materials Science: Materials in Electronics | Issue 18/2021

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Abstract

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point (139 °C) and cost. However, the frangibility and poor ductility of the SnBi low-temperature solder limits its application in the field of electronic packaging. In this paper, the research progress and development direction of SnBi low-temperature lead-free solder are discussed. To promote the application of SnBi solder, the melting characteristics, wettability, microstructure, tensile properties, shear properties, creep properties and interfacial reaction of SnBi solder are analyzed and introduced systematically. It provides an important reference of understanding the current development of SnBi solders.
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Literature
1.
H. Chen, L. Wang, J. Han et al., Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress. Microelectron. Eng. 96, 82–91 (2012)CrossRef
2.
A. Nabihah, M.S. Nurulakmal, Effect of In Addition on Microstructure, Wettability and Strength of SnCu Solder. Mater. Today 17, 803–809 (2019)
3.
F.Y. Ouyang, G.L. Hong, Y.R. Hsu et al., Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure. Microelectron. Reliab. 97, 16–23 (2019)CrossRef
4.
H.Z. Wang, X.W. Hu, X.X. Jiang et al., Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints. Mater. Charact. 163, 110287 (2020)CrossRef
5.
L. Liu, S.B. Xue, S.Y. Liu, Mechanical property of Sn-58Bi solder paste strengthened by resin. Appl. Sci. 8(11), 8112024 (2018)
6.
L.F. Hu, Y.Z. Xue, H. Wang, Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder. J. Alloy Compd. 19, 30179 (2019)
7.
B.Y. Han, F.L. Sun, T.H. Li et al., Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging. Solder. Surf. Mount Technol. 32(2), 57–64 (2019)CrossRef
8.
P. Zhang, S.B. Xue, J.H. Wang, New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints. Mater. Des. 192, 108726 (2020)CrossRef
9.
L. Shen, A.Q. Foo, S. Wang et al., Enhancing creep resistance of SnBi solder alloy with non-reactive nano fillers: a study using nanoindentation. J. Alloy Compd. 729, 498–506 (2017)CrossRef
10.
N. Jiang, L. Zhang, M.Y. Xiong et al., Research progress on lead-free soldering technology for electronic packaging. Mater. Rep. 33(12), 3862–3875 (2019)
11.
X. Wang, Y.C. Liu, Z.M. Gao, Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interface. J. Mater. Sci.: Mater. Electron. 22, 14–19 (2011)
12.
S.Q. Zhou, C.H. Yang, S.K. Lin et al., Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy. Mater. Sci. Eng. A 744, 560–569 (2019)CrossRef
13.
N. Jiang, L. Zhang, Z.Q. Liu et al., Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. J. Mater. Sci.: Mater. Electron. 30(19), 17583–17590 (2019)
14.
S. Amares, M.N.E. Efzan, R. Durairaj, et al., Influence of Nano-3%Al 2 O 3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy. In Materials Science and Engineering Conference Series. Materials Science and Engineering Conference Series (2017)
15.
M.A.A.M. Salleh, A.M.M.A. Bakri, M.H. Hazizi et al., Mechanical properties of Sn-0.7Cu/Si3N4 lead-free composite solder. Mater. Sci. Eng. A 556, 633–637 (2012)CrossRef
16.
C. Zhang, S.D. Liu, G.T. Qian et al., Effect of Sb content on properties of Sn-Bi solders. Chin. J. Nonferrous Met. 24, 184–191 (2014)CrossRef
17.
X.J. Wang, Y.L. Wang, F.J. Wang et al., Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder. Acta Metall. Sin. 27(6), 1159–1164 (2014)CrossRef
18.
J. Shen, Y. Pu, H. Yin et al., Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys. J. Alloy Compd. 614, 63–70 (2014)CrossRef
19.
A.A. El-Dalya, Y. Swilema, M.H. Makledb et al., Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys. J. Alloy Compd. 484, 134–142 (2009)CrossRef
20.
S.T. Oh, J.H. Lee, Microstructural, wetting, and mechanical characteristics of Sn-57.6Bi-0.4Ag alloys doped with metal-organic compounds. Electron. Mater. Lett. 10(2), 473–478 (2014)CrossRef
21.
R.M. Shalaby, Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys. Mater. Sci. Eng. A 560, 86–95 (2013)CrossRef
22.
Y.Y. Shiue, T.H. Chuang, Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads. J. Alloy Compd. 491(1–2), 610–617 (2010)CrossRef
23.
W.X. Dong, Y.W. Shi, Z. Xia et al., Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy. J. Electron. Mater. 37(7), 982–991 (2008)CrossRef
24.
T.H. Chuang, H.F. Wu, Effects of Ce addition on the microstructure and mechanical properties of Sn-58Bi solder joints. J. Electron. Mater. 40(1), 71–77 (2011)CrossRef
25.
Zhang L, Sun L, Guo Y H. Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. Journal of Materials Science: Materials in Electronics, 2015, 26(10):7629 – 7634.
26.
He P, An J, M X, et al. Investigation preparation method and soldering behaviors of Sn-58Bi lead-free solder with carbon nanotubes. Transactions of The China Welding Institution, 2011, 32(9):9–12.
27.
X. Chen, F. Xue, J. Zhou et al., Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder. J. Alloy Compd. 633, 377–383 (2015)CrossRef
28.
Q. Li, N.S. Ma, Y.P. Lei et al., Characterization of low-melting-point Sn-Bi-In lead-free solders. J. Electron. Mater. 45(11), 5800–5810 (2016)CrossRef
29.
M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)CrossRef
30.
L. Sun, M.H. Chen, L. Zhang, Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints. J. Alloy Compd. 786, 677–687 (2019)CrossRef
31.
S.K. Ghosh, A.S.M.A. Haseeb, A. Afifi, Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn-3.0Ag-0.5Cu and copper substrate. In 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). IEEE, (2013)
32.
G. Kumar, K.N. Prabhu, Review of non-reactive and reactive wetting of liquids on surfaces. Adv. Colloids Interface Sci. 133(2), 61–89 (2007)CrossRef
33.
M.Y. Xiong, L. Zhang, P. He, W.M. Long, Stress analysis and structural optimization of 3D IC package based on the Taguchi method. Solder. Surf. Mount Technol. 32(1), 42–47 (2020)CrossRef
34.
S.H. Rajendran, H. Kang, J.P. Jung, Ultrasonic-assisted dispersion of ZnO nanoparticles to Sn-Bi solder: a study on microstructure, spreading, and mechanical properties. J. Mater. Eng. Perform. 30, 3167–3172 (2021)CrossRef
35.
J. Liang, N. Dariavach, P. Callahan et al., Metallurgy and kinetics of liquid-solid interfacial reaction during lead-free soldering. Mater. Trans. 47(2), 317–325 (2006)CrossRef
36.
N. Jiang, L. Zhang, K.K. Xu et al., Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints. Int. J. Mod. Phys. B 35(1), 2150007 (2020)CrossRef
37.
F. Yang, L. Zhang, Z.Q. Liu et al., Effects of CuZnAl particles on properties and microstructure of Sn-58Bi solder. Materials 10(5), 558 (2017)CrossRef
38.
L. Yang, J. Dai, Y.C. Zhang et al., Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder. J. Electron. Mater. 15, 3796 (2015)
39.
L. Zhang, L. Sun, Y.H. Guo et al., Wettability of SnAgCu-xEu solders and mechanical properties of solder joints. Chin. Rare Earths 36(4), 51–55 (2015)
40.
Z. Wang, Q.K. Zhang, Y.X. Chen et al., Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints. J. Mater. Sci.: Mater. Electron. 30(20), 18524–18538 (2019)
41.
W.X. Dong, Y.W. Shi, Y.P. Lei et al., Effects of trace rare earth on microstructure and properties of SnBi based lead-free solder brazed joint. Weld. Join. 7, 43–46 (2008)
42.
Y.L. Li, Z.L. Wang, X.W. Li et al., Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn-35Bi-1Ag solder and Cu substrate. J. Mater. Sci.: Mater. Electron. 31(5), 4224–4236 (2020)
43.
J. Shen, Y. Pu, H. Yin et al., Effects of Cu, Zn on the wettability and shear mechanical properties of Sn-Bi-based lead-free solders. J. Electron. Mater. 44(1), 532–541 (2015)CrossRef
44.
L. Zang, Z. Yuan, H. Zhao et al., Wettability of molten Sn-Bi-Cu solder on Cu substrate. Mater. Lett. 63(23), 2067–2069 (2009)CrossRef
45.
V. Silva, G. Gouveia, R. Reyes et al., Sn-Bi(-Ga) TIM alloys: microstructure, tensile properties, wettability and interfacial reactions. J. Electron. Mater. 48(8), 4773–4788 (2019)CrossRef
46.
W.C. Yang, J.D. Li, Y.T. Li et al., Effect of aluminum addition on the microstructure and properties of non-eutectic Sn-20Bi solder alloys. Materials 12, 1194 (2019)CrossRef
47.
c. Suganuma, Foundation of Lead-Free Soldering Technology. Liu Z Q, Li M Y, Trans. (Science Press, China, Beijing, 2017)
48.
B.L. Silva, V.C.E. da Silva, A. Garcia et al., Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys. J. Electron. Mater. 46(3), 1754–1769 (2017)CrossRef
49.
D. Ye, C.C. Du, M.F. Wu et al., Microstructure and mechanical properties of Sn-xBi solder alloy. J. Mater. Sci.: Mater. Electron. 26(6), 3629–3637 (2015)
50.
L. Sun, M.H. Chen, L. Zhang et al., Effect of addition of CuZnAl particle on the properties of Sn solder joint. J. Mater. Process. Technol. 278, 116507 (2020)CrossRef
51.
L. Yang, C.C. Du, J. Dai et al., Effect of nanosized graphite on properties of Sn-Bi solder. J. Mater. Sci.: Mater. Electron. 24(11), 4180–4185 (2013)
52.
W.B. Zhu, M. Yong, X.Z. Li et al., Effects of Al2O3 nanoparticles on the microstructure and properties of Sn58Bi solder alloys. J. Mater. Sci.: Mater. Electron. 29(9), 7575–7585 (2018)
53.
A.K. Gain, L.C. Zhang, Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate. J. Mater. Sci.: Mater. Electron. 27(4), 1–13 (2016)
54.
X.Z. Li, Y. Ma, W. Zhou et al., Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys. Mater. Sci. Eng. A 684, 328–334 (2016)CrossRef
55.
Y. Li, Y.C. Chan, Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders. J. Alloy Compd. 645, 566–576 (2015)CrossRef
56.
Y. Liu, H. Zhang, F.L. Sun, Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints. J. Mater. Sci.: Mater. Electron. 27(3), 2235–2241 (2016)
57.
L. Sun, M.H. Chen, L.S. Xie et al., Properties and mechanism of nano Al particles reinforced Sn1.0Ag0.5Cu solders. Trans. The China Weld. Inst. 39(8), 47–50 (2018)
58.
L. Yang, L. Zhu, Y.C. Zhang et al., Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling. Mater. Charact. 148, 280–291 (2018)CrossRef
59.
H.W. Miao, J.G. Duh, B.S. Chiou, Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints. J. Mater. Sci.: Mater. Electron. 11(8), 609–618 (2000)
60.
M.J. Dong, Z.M. Gao, Y.C. Liu et al., Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder. Int. J. Miner. Metall. Mater. 19(11), 1029–1035 (2012)CrossRef
61.
X. Mao, R. Zhang, X. Hu, Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration. Intermetallics 131(11), 107107 (2021)CrossRef
62.
F.J. Wang, Y. Huang, C.C. Du, Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test. Mater. Sci. Eng. A 668, 224–233 (2016)CrossRef
63.
K. He, Y.P. Chen, D.A. Hu et al., Effect of Al element on microstructure and mechanical properties of hypoeutectic SnBi solder joint. Trans. Mater. Heat Treat. 41(3), 163–169 (2020)
64.
H. Wang, S.B. Xue, F. Zhao et al., Effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solder. Rare Met. 21(2), 111–119 (2009)
65.
W.B. Guo, Z.Y. She, H.T. Xue et al., Study on the effect of Ti, Al, Cu and Ag doping to the bonding properties of soldered β-Sn(100)/ZrO2(111) interface. Int. J. Appl. Ceram. Technol. 1, 1–9 (2020)
66.
H. Xu, D.J. Luo, Y.H. Yan et al., Effects of addition of trace elements on the structure and properties of multicomponent Sn-Bi based solder alloys. Micronanoelectron. Technol. 58(2), 124–130 (2021)
67.
X.J. Wang, B. Liu, H.L. Zhou et al., Effect of P on microstructure and mechanical properties of Sn-Bi solder. J. Mater. Eng. 44(7), 113–118 (2016)
68.
P. He, X.C. Lu, B.B. Zhang et al., Efect of alloy element on micro structure and impact toughness of Sn-57Bi lead-free solder. J. Mater. Eng. 31(10), 13–17 (2010)
69.
T.Q. Yang, X.C. Zhao, Z.S. Xiong et al., Improvement of microstructure and tensile properties of Sn-Bi-Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn. Mater. Sci. Eng. A 785, 139372 (2020)CrossRef
70.
W.B. Zhu, W.W. Zhang, W. Zhou et al., Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders. J. Alloy Compd. 789, 805–813 (2019)CrossRef
71.
W.X. Chen, S.B. Xue, H. Wang et al., Investigation on properties of Ga to Sn-9Zn lead-free solder. J. Mater. Sci.: Mater. Electron. 21(5), 496–502 (2010)
72.
L.Z. Yang, W. Zhou, Y. Ma et al., Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Mater. Sci. Eng. A 667(14), 368–375 (2016)CrossRef
73.
Y. Ma, X.Z. Li, L.Z. Yang et al., Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater. Sci. Eng. A 696, 437–444 (2017)CrossRef
74.
Y.L. Huang, Z.Y. Xiu, G.H. Wu et al., Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets. J. Mater. Sci.: Mater. Electron. 27(7), 6809–6815 (2016)
75.
D.L. Ma, P. Wu, Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. J. Alloys Compds. 671, 127–136 (2016)CrossRef
76.
Y.F. Jing, L. Yang, J.G. Ge et al., Influence of electromigration on microstructure and mechanical properties of Sn58Bi solder. Hot Work. Technol. 44(7), 2473–2478 (2015)
77.
Z. Zhao, L. Liu, H.S. Choi et al., Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-30Ag-05Cu solder joints. Microelectron. Reliab. 60, 126–134 (2016)CrossRef
78.
Q.K. Zhang, H.F. Zou, Z.F. Zhang, Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate. J. Mater. Res. 25(02), 303–314 (2010)CrossRef
79.
H.F. Zou, Q.K. Zhang, Z.F. Zhang, Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate. Mater. Sci. Eng., A 532(15), 167–177 (2012)CrossRef
80.
S. Cheng, C.M. Huang, M. Pecht, A review of lead-free solders for electronics applications. Microelectron. Reliab. 75, 77–95 (2017)CrossRef
81.
F.J. Wang, Y. Huang, D. Li, The shear strength and fracture mode of Sn- x Bi (x=0, 2.5, 5, 15)/Cu solder joints// 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, (2017)
82.
G. Jeong, D.Y. Yu, S. Baek et al., Interfacial reactions and mechanical properties of Sn-58Bi solder joints with ag nanoparticles prepared using ultra-fast laser bonding. Materials 14(2), 335 (2021)CrossRef
83.
Y.Q. Wan, S. Li, X.W. Hu et al., Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates. Microelectron. Reliab. 86, 27–37 (2018)CrossRef
84.
Q.K. Zhang, Z.F. Zhang, In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints. Mater. Sci. Eng. A 528(6), 2686–2693 (2011)CrossRef
85.
S. Amares, T. Bandar, Effect on shear strength and hardness properties of tin based solder alloy, Sn-50Bi, Sn-50Bi+2%TiO2 nanoparticles. Adv. Mater. Res. 1159, 54–59 (2020)CrossRef
86.
Z.B. Li, D.A. Hu, Y.P. Chen et al., Effect of Fe particles on the structure and properties of SnBi/Cu joint during aging. Trans. China Weld. Inst. 41(8), 22–28 (2020)
87.
M.M. Billah, Q.F. Chen, Strength of MWCNT-reinforced 70Sn-30Bi solder alloys. J. Electron. Mater. 45(1), 1–6 (2015)
88.
Y. Liu, S.L. Li, H. Zhang et al., Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates. J. Mater. Sci.: Mater. Electron. 29, 1–9 (2018)
89.
T.T. Dele-Afolabi, M.A.A. Hanim, R. Calin et al., Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions. Microelectron. Reliab. 110, 3681 (2020)CrossRef
90.
C.J. Lee, K.D. Min, B.W. Hwang et al., The effect of pH on synthesizing Ni-decorated MWCNTs and its application for Sn-58Bi solder. Curr. Appl. Phys. 19(11), 1182–1186 (2019)CrossRef
91.
T.T. Dele-Afolabi, M.A.A. Hanim, M. Norkhairunnisa et al., Growth kinetics of intermetallic layer in lead-free Sn-5Sb solder reinforced with multi-walled carbon nanotubes. J. Mater. Sci.: Mater. Electron. 26, 8249–8259 (2015)
92.
Y. Liu, B.Q. Ren, M. Zhou et al., Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints. Appl. Phys. A 126(9), 1–10 (2020)
93.
Y. Peng, K. Deng, Study on the mechanical properties of the novel Sn-Bi/graphene nanocomposite by finite element simulation. J. Alloy Compd. 625(1), 44–51 (2015)CrossRef
94.
Lv Y, Yang W C, Mao J, et al. Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn-0.7Cu solder alloy. Journal of Materials Science Materials in Electronics, 2020, 31:202–211.
95.
L. Sun, M.H. Chen, C.C. Wei et al., Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints. J. Mater. Sci.: Mater. Electron. 29(12), 9757–9763 (2018)
96.
H.G. Song, J.W. Morris, F. Hua, The creep properties of lead-free solder joints. JOM 54(6), 30–32 (2002)CrossRef
97.
Y. Zuo, L.M. Ma, F. Guo et al., Effects of electromigration on the creep and thermal fatigue behavior of Sn58Bi solder joints. J. Electron. Mater. 43(12), 4395–4405 (2014)CrossRef
98.
R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi et al., Room-temperature indentation creep of lead-free Sn-Bi solder alloys. J. Mater. Sci.: Mater. Electron. 18(10), 1071–1078 (2007)
99.
L. Hu, M. Zeng, Y.M. Zhang et al., Effect of Ag on indentation creep property and microstructure of Sn-Bi solder. J. Xihua Univ. 29(4), 72–74 (2010)
100.
D.L. Ma, P. Wu, Effects of Zn addition on mechanical properties of eutectic Sn-58Bi solder during liquid-state aging. Trans. Nonferrous Met. Soc. China 25(4), 1225–1233 (2015)CrossRef
101.
F.A. El-Salam, A. El-Khalek, R.H. Nada et al., Effect of silver addition on the creep parameters of Sn–7 wt.% Bi alloy during transformation. Mater. Charact. 59(1), 9–17 (2008)CrossRef
102.
C.H. Zhang, N. Zhang, S.M. Wang et al., Effect of creep on interface morphology and mechanical properties of Cu/SnBi-xSm/Cu solder joint. Foundry Technol. 39(2), 415–422 (2018)
103.
H. Zhang, F.L. Sun, Y. Liu, Copper foam enhanced Sn58Bi solder joint with high performance for low temperature packaging. Mater. Lett. 241, 108–110 (2019)CrossRef
104.
L. Liu, S.B. Xue, R.Y. Ni et al., Study on the reliability of Sn-Bi composite solder pastes with thermosetting epoxy under thermal cycling and humidity treatment. Crystal 11, 1–11 (2021)
105.
H. Gao, F.X. Wei, Y.W. Sui et al., Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn-Cu-Bi solder and Cu substrate. J. Mater. Sci.: Mater. Electron. 30(3), 2186–2191 (2019)
106.
Y.Q. Lai, X.W. Hu, Y.L. Li et al., Influence of Bi addition on pure Sn solder joints: interfacial reaction, growth behavior and thermal behavior. J. Wuhan Univ. Technol. (Mater. Sci.) 34(03), 668–675 (2019)CrossRef
107.
Q. Yu, X.W. Hu, Y.L. Li et al., Interfacial reaction between liquid-state Sn-x Bi solder and Co substrate. J. Mater. Sci.: Mater. Electron. 29(11), 9155–9165 (2018)
108.
T.Y. Kang, Y.Y. Xiu, C.Z. Liu et al., Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect. J. Alloy Compd. 509(5), 1785–1789 (2011)CrossRef
109.
Q.K. Zhang, H.F. Zou, Z.F. Zhang, Bi segregation mechanism and time-dependent brittleness inhibition at SnBi/Cu interface. Sci. Sin. Technol. 42(01), 13–21 (2012)CrossRef
110.
Y. Goh, A. Haseeb, H.L. Liew et al., Deformation and fracture behavior of electroplated Sn-Bi/Cu solder joints. J. Mater. Sci. 50(12), 4258–4269 (2015)CrossRef
111.
C.C. Cao, K.K. Zhang, B.J. Shi et al., The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading. Metals 9(5), 518 (2019)CrossRef
112.
T.Y. Kang, Y.Y. Xiu, B. Xu et al., Effect of Ni addition on the formation and growth of intermetallic compound at eutectic SnBi/Cu interface. Adv. Mater. Res. 160–162, 709–714 (2011)
113.
Q.F. Wang, H. Chen, F.J. Wang, Effect of trace Zn addition on interfacial evolution in Sn-10Bi/Cu solder joints during aging condition. Materials 12, 4240 (2019)CrossRef
114.
J. Shen, C.P. Wu, S.Z. Li, Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35BilAg solder alloys. J. Mater. Sci. 23(1), 156–163 (2012)
115.
L.Z. Yang, Z. Wei, X.Z. Li et al., Effect of Ni and Ni-coated carbon nanotubes on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layers. J. Mater. Sci.: Mater. Electron. 27(11), 1–7 (2016)
116.
Q. Li, J.H. Huang, H. Zhang et al., Effect of Al on the structure and properties of Sn-58Bi lead-free solder. Electron. Process Technol. 1, 1–4 (2008)
117.
J.F. Li, S.H. Mannan, M.P. De Clo et al., Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects. Acta Mater. 54(11), 2907–2922 (2006)CrossRef
118.
C.P. Wu, J. Shen, C.F. Peng, Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints. J. Mater. Sci.: Mater. Electron. 23(1), 14–21 (2012)
119.
F.Q. Hu, Q.K. Zhang, J.J. Jiang et al., Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction. Mater. Lett. 214, 142–145 (2017)CrossRef
120.
N. Jiang, L. Zhang, L. Sun et al., Effect of thermal cycling on interface and properties of Sn58Bi (nano Ti)/Cu solder joints. Rare Met. Mater. Eng. 50(1), 328–332 (2021)
121.
N. Jiang, L. Zhang, W.M. Long et al., Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid-liquid diffusion. J. Mater. Sci.: Mater. Electron. 32, 3341–3351 (2021)
122.
Z. Zhu, Y.C. Chan, F. Wu, Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint. In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE (2015)
123.
W.C. Zhu, Z.J. Yang, Y.K. Fu et al., Effect of graphene nanosheet addition on the wettability and mechanical properties of Sn-20Bi-xGNS/Cu solder joints. Materials 13, 3968 (2020)CrossRef
124.
M.Y. Xiong, L. Zhang, L. Sun et al., Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints. Vacuum 167, 301–306 (2019)CrossRef
125.
L. Zhang, Z.Q. Liu, Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci.: Mater. Electron. 31(3), 2466–2480 (2020)
126.
C.W. Lee, Y.S. Shin, S.H. Yoo, Effect of SiC nanoparticles dispersion on the microstructure and mechanical properties of electroplated Sn-Bi solder alloy. J. Nano Res. 11, 113–118 (2010)CrossRef
127.
B.B. Song, Y. Li, S.Y. Zhou et al., Effect of thermal cycling on microstructure and mechanical properties of Sn-58Bi-xCNTs/Cu solder joint. Weld. Join. 4, 27–32 (2018)
128.
L. Yang, H.X. Liu, Y.C. Zhang et al., Study on the reliability of carbon nanotube-reinforced Sn-58Bi lead-free solder joints. J. Mater. Eng. Perform. 26(12), 1–9 (2017)
129.
C.J. Lee, W.R. Myung, B.G. Park et al., Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package. J. Mater. Sci.: Mater. Electron. 31, 10170–10176 (2020)
130.
X. Gu, D. Yang, Y.C. Chan et al., Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints. J. Mater. Res. 23(10), 2591–2596 (2008)CrossRef
131.
H.W. He, G.C. Xu, F. Guo, Evolution of microstructure and morphology of eutectic SnBi solder joint during electromigration process at high temperature. Rare Met. Mater. Eng. 39, 251–254 (2010)
132.
L.M. Ma, Y. Zuo, S.H. Liu et al., The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling. J. Appl. Phys. 113(4), 044904 (2013)CrossRef
133.
G.C. Xu, H.W. He, J.K. Nie et al., Electromigration suppressing effect of Ni particle on SnBi soldering point. Electron. Components Mater. 27(11), 60–63 (2008)
134.
L. Yang, H.Y. Liu, P.P. Wu, Effect of Fe particle on electromigration for SnBi solder. Hot Work. Technol. 45(17), 216–218 (2016)
135.
H.W. He, G.C. Xu, F. Guo, Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple. J. Mater. Sci. 44(8), 2089–2096 (2009)CrossRef
136.
C.M. Chen, C.C. Huang, Effects of silver doping on electromigration of eutectic SnBi solder. J. Alloy Compd. 461, 235–241 (2008)CrossRef
Metadata
Title
Recent advances on SnBi low-temperature solder for electronic interconnections
Authors
Nan Jiang
Liang Zhang
Li-Li Gao
Xiao-Guo Song
Peng He
Publication date
26-08-2021
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 18/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-021-06820-7

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