SCF-NiFe₂O₄/epoxy composites with high thermal conductivity and electromagnetic interference resistance

With the development of electronic components towards high power, high packaging density, and miniaturization of device size, heat dissipation and the electromagnetic interference problems between the electronic components are emerging. In order to solve the undesirable electromagnetic wave and heat emissions produced by electronic device simultaneously, the electronic packaging materials with high thermal conductivity and anti-electromagnetic interference are highly expected. In this work, NiFe₂O₄-modified short carbon fibers (SCF) were designed and prepared. NiFe₂O₄ were in situ grown on the surface of SCF by hydrothermal method. The chemical structure and morphology of SCF-NiFe₂O₄ were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The microwave absorbing performance test shows that SCF-NiFe₂O₄ possess superior microwave absorbing performance, where the minimum reflection loss is − 20.7 dB. Finally, SCF-NiFe₂O₄/epoxy resin composites were prepared by introducing SCF-NiFe₂O₄ as thermal conductive filler into epoxy resin. The surface-modified SCF with NiFe₂O₄ is more easily infiltrated by resin and exhibits strong interfacial interaction with the matrix. With the increase of the content of SCF-NiFe₂O₄, the thermal conductivity of the composites increases obviously. When the content of SCF-NiFe₂O₄ reaches 20 vol%, the composites show better thermal conductivity, and the thermal conductivity reaches 1.03 W/m K.