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Journal of Materials Science: Materials in Electronics

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12-11-2019

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Authors: Haijiao Zhan, Jiayu Guo, Xiazhen Yang, Bing Guo, Wei Liu, Hangyan Shen, Xiaorong Wang, Weigang Tang, Fei Chen

Published in: Journal of Materials Science: Materials in Electronics | Issue 24/2019

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Abstract

There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10⁻⁶ Ω m and excellent adhesion strength after being cured at 140 °C in an oven.

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Title: Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes
Authors: Haijiao Zhan
Jiayu Guo
Xiazhen Yang
Bing Guo
Wei Liu
Hangyan Shen
Xiaorong Wang
Weigang Tang
Fei Chen
Publication date: 12-11-2019
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 24/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-019-02511-6

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