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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 11/2017

11-02-2017

Study on the microstructure and properties of low-Ag Sn–0.3Ag–0.7Cu–0.5Ga solder alloys bearing Pr

Authors: He Wang, Songbai Xue, JianXin Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 11/2017

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Abstract

Effect of Pr element on the wettability, microstructure, interface morphology and mechanical property of Sn–0.3Ag–0.7Cu–0.5Ga–xPr solder has been studied. The result exhibits that the wettability of solders could significantly be improved by adding an approximate amount of Pr, for the forming of well-distributed PrSn3 IMCs could serve as the sites of heterogeneous nucleation, subsequently leading to the refinement of β-Sn matrix and reducing the growth of IMCs. Therefore, the thickness of the IMC layers at the interface (Cu plate/solder) is reduced, implying that the morphology is optimized. The promotion of mechanical properties is also correlated to the refining of IMC layer.
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Metadata
Title
Study on the microstructure and properties of low-Ag Sn–0.3Ag–0.7Cu–0.5Ga solder alloys bearing Pr
Authors
He Wang
Songbai Xue
JianXin Wang
Publication date
11-02-2017
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 11/2017
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-6537-y

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