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Journal of Materials Science: Materials in Electronics

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01-04-2014

The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

Authors: Keke Zhang, Xiaojiao Zhang, Ranfeng Qiu, Hongxin Shi, Yujie Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 4/2014

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Abstract

The effect of ultrasonic wave (USW) and electric field (E) on the solderability of Sn2.5Ag0.7Cu0.1RE/Cu was investigated. Compared with the sample soldered conventionally, the solder joint obtained with USW and E assisted resulted in significant changes in the microstructure. The thickness and roughness of the interfacial Cu₆Sn₅ intermetallic compound (IMC) layer decreased by 39 and 56 %, respectively. The shear strength of the solder joint increased by 68 %, and the fracture mechanism of the solder joint transformed from brittle fracture occurred in the interfacial IMC layer to ductile fracture occurred in the solder alloy. The results reveal that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved with USW and E assisted, despite of low-halogen flux.

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Title: The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints
Authors: Keke Zhang
Xiaojiao Zhang
Ranfeng Qiu
Hongxin Shi
Yujie Liu
Publication date: 01-04-2014
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 4/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-014-1783-8

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