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Polymer Science, Series D
Published in: Polymer Science, Series D 2/2022

01-06-2022

Thermally Stable Polyimide Structural Adhesives

Authors: M. A. Zharinov, A. P. Petrova, I. V. Babchuk, K. R. Akhmadieva

Published in: Polymer Science, Series D | Issue 2/2022

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Abstract

A review is presented of thermally stable polymer polyimide based adhesives capable of long-term operation at temperatures above 200°C. The most frequently applied methods for the synthesis of polyimides and their forepolymers are considered, alongside with the processes occurring in the course of their curing at terminal molding stages. The principal advantages and shortcomings of existing polyimide adhesives are demonstrated.
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Literature
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D. S. Lavrishchev and Yu. A. Mikhailin, “Polyimide adhesives,” Klei. Germetiki. Tekhnol., No. 8, 13–18 (2006).
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Metadata
Title
Thermally Stable Polyimide Structural Adhesives
Authors
M. A. Zharinov
A. P. Petrova
I. V. Babchuk
K. R. Akhmadieva
Publication date
01-06-2022
Publisher
Pleiades Publishing
Published in
Polymer Science, Series D / Issue 2/2022
Print ISSN: 1995-4212
Electronic ISSN: 1995-4220
DOI
https://doi.org/10.1134/S1995421222020332

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