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Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 8/2016

14-06-2016

Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC p Composite Using Mixed Cu-Ag Powder Interlayer

Authors: Pallab Roy, Tapan Kumar Pal, Joydeep Maity

Published in: Journal of Materials Engineering and Performance | Issue 8/2016

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Abstract

Microstructure and shear strength of transient liquid phase diffusion bonded (560 °C, 0.2 MPa) 6061Al-15 wt.% SiCp extruded composite using a 50-µm-thick mixed Cu-Ag powder interlayer have been investigated. During isothermal solidification that took 2 h for completion, a ternary liquid phase formed due to diffusion of Cu and Ag in Al. Subsequent cooling formed a ternary phase mixture (α-Al + CuAl2 + Ag2Al) upon eutectic solidification. With mixed Cu-Ag powder interlayer, isothermal solidification was faster than for pure Al joints made using a 50-µm-thick Cu foil interlayer and for the composite joints made using a 50-µm-thick Cu foil/powder interlayer under similar conditions. The presence of brittle eutectic phase mixture (CuAl2 + Ag2Al) led to poor joint strength at short TLP bonding times. The mixture disappeared upon isothermal solidification with a 2-h hold yielding improved joint strength even with solidification shrinkage in the joint. Increased holding time (6 h) erased shrinkage via solid state diffusion and yielded the highest joint strength (87 MPa) and fair joint efficiency (83%).
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Metadata
Title
Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC p Composite Using Mixed Cu-Ag Powder Interlayer
Authors
Pallab Roy
Tapan Kumar Pal
Joydeep Maity
Publication date
14-06-2016
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 8/2016
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-016-2165-6

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