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Journal of Materials Science: Materials in Electronics

Published in:

01-07-2015

Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere

Authors: C. Gonçalves, H. Leitão, C. S. Lau, J. C. Teixeira, L. Ribas, S. Teixeira, M. F. Cerqueira, F. Macedo, D. Soares

Published in: Journal of Materials Science: Materials in Electronics | Issue 7/2015

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Abstract

The wettability between solder and substrate is a very important issue in reliability of soldering process. The contact angle θ is used to measure the degree of wetting. The contact angle of lead-free alloy Sn-3 % Ag-0.5 % Cu (wt%) was measured, as a function of temperature, for three different commercial surface finish substrates used in printed circuit boards (PCB): Sn, NiAu and Organic Solderability Preservative (OSP). The measurements were performed by the sessile drop method in two different atmospheres: high vacuum and inert gas. In high vacuum the results showed that on substrates of NiAu and OSP the solder started spreading suddenly at 225 °C and in Sn substrate the contact angle decreases slightly with temperature. In inert gas atmosphere the results showed different behaviours: the contact angle between molten solder in OSP and NiAu substrates is sensitive to temperature; and, in Sn substrate, the contact angle does not change with temperature. The NiAu and OSP substrates showed a better degree of wettability than Sn substrate, in inert atmosphere.

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Title: Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere
Authors: C. Gonçalves
H. Leitão
C. S. Lau
J. C. Teixeira
L. Ribas
S. Teixeira
M. F. Cerqueira
F. Macedo
D. Soares
Publication date: 01-07-2015
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 7/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-015-3037-9

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