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Journal of Electronic Materials
Published in: Journal of Electronic Materials 10/2021

06-08-2021 | Review Article

Brief Review of Nanosilver Sintering: Manufacturing and Reliability

Authors: Jintao Wang, Si Chen, Luobin Zhang, Xueting Zhao, Fangcheng Duan, Hongtao Chen

Published in: Journal of Electronic Materials | Issue 10/2021

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Abstract

In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed.

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previous article First-Principles Study of the Half-Metallic Properties of (001), (110), and (111) Surfaces of RbSe in the CsCl Structure
next article Electronic Structure and Quantum Transport Properties of 2D SiP: A First-Principles Study

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Metadata
Title
Brief Review of Nanosilver Sintering: Manufacturing and Reliability
Authors
Jintao Wang
Si Chen
Luobin Zhang
Xueting Zhao
Fangcheng Duan
Hongtao Chen
Publication date
06-08-2021
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 10/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-021-09078-1

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