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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 6/2019

12.02.2019

Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications

verfasst von: Fan Yang, Bo Hu, Ye Peng, Chunjin Hang, Hongtao Chen, Changwoo Lee, Jun Wei, Mingyu Li

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2019

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Abstract

A silver (Ag) composite paste was fabricated based on Ag nanoparticles (NPs) and Ag microflakes (MFs). Robust interconnections were achieved after sintering in the temperature range of 150–225 °C. The shear strengths of the Ag MF + NP joints before and after thermal shock from − 50 to 150 °C for 1000 cycles were 155.7 ± 14.5 MPa and 78.4 ± 20.8 Mpa, respectively. The results show that the Ag composite paste not only has similar sintering properties to the Ag NP pastes but also exhibited superior mechanical reliability due to the addition of the Ag MFs. In addition, the sintered properties of different Ag pastes were discussed in terms of the coating organics, thermal behaviour and microstructure. The fracture modes after the shearing tests were analysed in detail. The Ag composite paste provides a potential solution for high-temperature applications.
Vorheriger Artikel Photoelectrical characteristics of novel Ru(II) complexes based photodiode
Nächster Artikel A homemade self-healing material utilized as multi-functional binder for long-lifespan lithium–sulfur batteries

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Metadaten
Titel
Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications
verfasst von
Fan Yang
Bo Hu
Ye Peng
Chunjin Hang
Hongtao Chen
Changwoo Lee
Jun Wei
Mingyu Li
Publikationsdatum
12.02.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-00846-8

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