Top

Journal of Electronic Materials

Published in:

03-01-2021 | Original Research Article

Effect of Single Crystallization on Thermoelectric Performance Improvement of Ba₈Cu_xSi_46−x Clathrate

Authors: Zilong Zhang, Chiho Inoue, Masahide Yasuda, Yuichiro Magami, Makoto Arita, Shinji Munetoh

Published in: Journal of Electronic Materials | Issue 3/2021

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

The thermoelectric properties of single-crystalline and polycrystalline n-type Ba₈Cu_xSi_46−x type I clathrate were investigated and compared. Single-crystalline Ba₈Cu_xSi_46−x clathrate was synthesized by the Czochralski (CZ) method with a Cu content gradient, while spark plasma sintering (SPS) was used for the reorganization of polycrystalline materials. The same Cu content resulted in almost the same Seebeck coefficient in both single-crystalline and polycrystalline crystals, while the power factor \( \left( {{\text{PF}} = S^{2} /\rho } \right) \) of single-crystalline clathrate is twice that of polycrystalline clathrate. Thus, single crystallization is effective for the synthesis of high-efficiency thermoelectric materials in a type I Ba₈Cu_xSi_46−x clathrate ternary system.

previous article Surface-Oxidation-Induced Constrained Volume Expansion of Commercial Silicon Flakes as High-Performance Anode Material for Lithium-Ion Batteries

next article Alternative Method for Production of Pb Halide Perovskite with High Current Response for Photodetection Devices

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

L.E. Bell, Science 321, 1457 (2008).CrossRef

G.J. Snyder and E.S. Toberer, Nat. Mater. (2008). https://doi.org/10.1038/nmat2090.CrossRef

Y. Dong, X. Ding, X. Yan, L. Zhang, Z. Tang, W. Chen, P. Rogl, and S. Paschen, Materials (2018). https://doi.org/10.3390/ma11060946.CrossRef

C.C. Sorrell, S. Sugihara, and J. Nowotny, Materials for Energy Conversion Devices, 1st ed. (Cambridge: Woodhead, 2005), pp. 339–357.CrossRef

H. Beyer, J. Nurnus, H. Böttner, A. Lambrecht, E. Wagner, and G. Bauer, Physica E (Amsterdam, Neth.) (2002). https://doi.org/10.1016/s1386-9477(02)00246-1.CrossRef

Y. Li, Y. Liu, N. Chen, G. Cao, Z. Feng, and J.H. Ross, Phys. Lett. A (2005). https://doi.org/10.1016/j.physleta.2005.07.015.CrossRef

T.M. Tritt and M. Subramanian, MRS Bull. (2006). https://doi.org/10.1557/mrs2006.44.CrossRef

B. Sun, X. Jia, D. Huo, H. Sun, Y. Zhang, B. Liu, H. Liu, L. Kong, B. Liu, and H. Ma, J. Phys. Chem. C (2016). https://doi.org/10.1021/acs.jpcc.6b02678.CrossRef

H. Zhang, H. Borrmann, N. Oeschler, C. Candolfi, W. Schnelle, M. Schmidt, U. Burkhardt, M. Baitinger, J.-T. Zhao, and Y. Grin, Inorg. Chem. 50, 1250 (2011). https://doi.org/10.1021/ic1016559.CrossRef

10.

Y. Saiga, B. Du, S.K. Deng, K. Kajisa, and T. Takabatake, J. Alloys Compd. 537, 303 (2012). https://doi.org/10.1016/j.jallcom.2012.05.049.CrossRef

11.

N. Mugita, Y. Nakakohara, R. Teranishi, and S. Munetoh, J. Mater. Res. (2011). https://doi.org/10.1557/jmr.2011.193.CrossRef

12.

Y. Onizuka, T. Oka, T. Osada, H. Miura, S. Munetoh, and O. Furukimi, J. Electron. Mater. (2014). https://doi.org/10.1007/s11664-013-2948-6.CrossRef

13.

E.S. Toberer, M. Christensen, B.B. Iversen, and G.J. Snyder, Phys. Rev. B (2008). https://doi.org/10.1103/PhysRevB.77.075203.CrossRef

14.

X. Yan, G. Giester, E. Bauer, P. Rogl, and S. Paschen, J. Electron. Mater. (2010). https://doi.org/10.1007/s11664-010-1253-x.CrossRef

15.

L. Yang, Y. Wang, T. Liu, T.D. Hu, B.X. Li, K. Ståhl, S.Y. Chen, M.Y. Li, P. Shen, G.L. Lu, Y.W. Wang, and J.Z. Jiang, J. Solid State Chem. (2005). https://doi.org/10.1016/j.jssc.2005.03.015.CrossRef

16.

S. Munetoh, M. Saisho, T. Oka, T. Osada, H. Miura, and O. Furukimi, J. Electron. Mater. (2014). https://doi.org/10.1007/s11664-014-3118-1.CrossRef

17.

X. Yan, S. Populoh, A. Weidenkaff, P. Rogl, and S. Paschen, J. Electron. Mater. (2016). https://doi.org/10.1007/s11664-015-4242-2.CrossRef

18.

Y.C. Cho, S. Lee, M. Ajmal, W.K. Kim, C.R. Cho, S.Y. Jeong, J.H. Park, S.E. Park, S. Park, H.K. Pak, and H.C. Kim, Cryst. Growth Des. (2010). https://doi.org/10.1021/cg1003808.CrossRef

19.

V.L. Kuznetsov, L.A. Kuznetsova, A.E. Kaliazin, and D.M. Rowe, J. Appl. Phys. (Melville, NY, U. S.) (2000). https://doi.org/10.1063/1.373469.CrossRef

20.

H. Anno, H. Yamada, T. Nakabayashi, M. Hokazono, and R. Shirataki, J. Phys: Conf. Ser. (2012). https://doi.org/10.1088/1742-6596/379/1/012007.CrossRef

21.

Y. Nagatomo, N. Mugita, Y. Nakakohara, M. Saisho, M. Tajiri, R. Teranishi, and S. Munetoh, J. Phys: Conf. Ser. (2012). https://doi.org/10.1007/s11664-014-3385-x.CrossRef

22.

H.K. Sato, H. Tamaki, and T. Kanno, Appl. Phys. Lett. (2020). https://doi.org/10.1063/5.0009687.CrossRef

23.

X. Yan, M.X. Chen, S. Laumann, E. Bauer, P. Rogl, R. Podloucky, and S. Paschen, Phys. Rev. B (2012). https://doi.org/10.1103/PhysRevB.85.165127.CrossRef

Title: Effect of Single Crystallization on Thermoelectric Performance Improvement of Ba8CuxSi46−x Clathrate
Authors: Zilong Zhang
Chiho Inoue
Masahide Yasuda
Yuichiro Magami
Makoto Arita
Shinji Munetoh
Publication date: 03-01-2021
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 3/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-020-08649-y

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Other articles of this Issue 3/2021

Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Temperature Gradient-Dominated Electrical Behaviours in a Piezoelectric PN Junction

Ferroelectric BT–PVDF Composite Thick Films for Electrical Energy Storage

Cation Substitution of Copper by Silver in the Earth-Abundant Compound Cu2ZnSnS4: Comparative Study of Structural, Morphological, and Optical Properties

Tailoring the Size and Magnetization of Titanium-Doped BiFeO3 Nanorods

Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu3Sn Phase in Sn-10 wt.%Cu Alloys