Top

Journal of Materials Engineering and Performance

Published in:

16-07-2020

Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy

Authors: Kangli Li, Jian Lin, Tongju Wang, Yongping Lei, Hanguang Fu

Published in: Journal of Materials Engineering and Performance | Issue 7/2020

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

In this paper, the effects of xGe (x = 0, 0.002, 0.005, 0.01%) on the melting point, spreadability, wettability, microstructure, and mechanical properties of Sn-32Pb-18Cd solder alloys were investigated. The experiment results showed that the addition of Ge could increase the spreading area and wetting properties. The microstructures of solder alloy after reflowing were mainly composed of Pb phase and β-Sn phases, and the Cd element was distributed in the matrix. The addition of Ge could enhance the tensile strength and ductility. When the Ge content was equal to 0.005%, the maximum elongation reached 53.70%.

previous article Friction and Reciprocating Wear Behavior of Borided AISI H13 Steel Under Dry and Lubricated Conditions

next article Investigation of Crystallization and Mechanical Characteristics of Glass and Glass-Ceramic with the Compositions xFe2O3-35SiO2-35B2O3-10Al2O3-(20−x) Na2O

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

Y. Ding, G.D. Wu, X.L. Wang et al., Tensile Testing and Microstructure Analysis on Sn–32Pb–18Cd and Sn–Pb Eutectic Solder, in 2014 15th International Conference on Electronic Packaging Technology. IEEE, 2014, p 893–897

L.E.E. Kyun-Gmee, S.O.N. Yong-Keun, L.E.E. Jin-Sook et al., Comparative Analysis on Homogeneity of Pb and Cd in Epoxy Molding Compounds, Trans. Nonferrous Met. Soc. China, 2011, 21, p s160–s164CrossRef

L.C. Prasad and A. Mikula, Role of Surface Properties on the Wettability of Sn–Pb–Bi Solder Alloys, J. Alloys Compd., 1999, 282(1–2), p 279–285CrossRef

H. Zhang, Y. Liu, F. Sun et al., Effects of Nano-Copper Particles on the Properties of Sn58Bi Composite Solder Pastes, Microelectron. Int., 2017, 34(1), p 40–44CrossRef

R. Koleňák, I. Kostolny et al., Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper, Metals, 2018, 8(4), p 274CrossRef

X. Tu, D. Yi, J. Wu et al., Influence of Ce Addition on Sn-3.0Ag-0.5Cu Solder Joints: Thermal Behavior, Microstructure and Mechanical Properties, J. Alloys Compd., 2017, 698, p 317–328CrossRef

J. Shen, Y. Pu, H. Yin et al., Effects of Minor Cu and Zn Additions on The Thermal, Microstructure and Tensile Properties of Sn–Bi-Based Solder Alloys, J. Alloys Compd., 2014, 614, p 63–70CrossRef

W.C. Huang and K.L. Lin, Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn–25Sn–xTi Solder and Cu, J. Electron. Mater., 2016, 45(12), p 6137–6142CrossRef

S.A. Belyakov, J.W. Xian, K. Sweatman et al., Influence of Bismuth on the Solidification of Sn–0.7Cu–0.05Ni–xBi/Cu Joints, J. Alloys Compd., 2017, 701, p 321–334CrossRef

10.

Y. Tang, S.M. Luo, W.F. Huang et al., Effects of Mn Nanoparticles on Tensile Properties of Low-Ag Sn–0.3 Ag–0.7 Cu–xMn Solder Alloys and Joints, J. Alloys Compd., 2017, 719, p 365–375CrossRef

11.

W. Dong, Y. Shi, Z. Xia et al., Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn–Bi-Based Solder Alloy, J. Electron. Mater., 2008, 37(7), p 982–991CrossRef

12.

S. Zhou, C. Yang, Y.A. Shen et al., The Newly Developed Sn–Bi–Zn Alloy with a Low Melting Point, Improved Ductility, High Ultimate Tensile Strength, Materialia, 2019, 6, p 100300CrossRef

13.

X. Zhang, X. Hu, X. Jiang et al., Effects of Germanium on the Microstructural, Mechanical and Thermal Properties of Sn–0.7 Cu Solder Alloy, Mater. Res. Express, 2018, 6(1), p 016556CrossRef

14.

S.H. Wang, T.S. Chin, C.F. Yang et al., Pb-Free Solder-Alloy Based on Sn–Zn–Bi with the Addition of Germanium, J. Alloys Compd., 2010, 497(1–2), p 428–431CrossRef

15.

M. Hasnine, B. Tolla, M. Karasawa et al., Effect of Ge Addition on Wettability, Copper Dissolution, Microstructural and Mechanical Behavior of SnCu–Ge Solder Alloy, J. Mater. Sci. Mater. Electron., 2017, 28(21), p 16106–16119CrossRef

16.

S.W. Cho, Thermal Oxidation Study on Lead-Free Solders of Sn–Ag–Cu and Sn–Ag–Cu–Ge, Adv. Eng. Mater., 2010, 8(1–2), p 111–114

17.

M.I.I. Ramli, M.A.A. Mohd Salleh, F.A. Mohd Sobri et al., Relationship Between Free Solder Thickness to the Solderability of Sn–0.7Cu–0.05Ni Solder Coating During Soldering, J. Mater. Sci. Mater. Electron., 2019, 30, p 3669–3677CrossRef

18.

J. Wu, S. Xue, J. Wang et al., Effects of α-Al₂O₃ Nanoparticles-Doped on microstructure and Properties of Sn–0.3Ag–0.7Cu Low-Ag Solder, J. Mater. Sci. Mater. Electron., 2018, 29(9), p 7372–7387CrossRef

19.

W. Xing, X. Yu, H. Li et al., Effect of Nano Al₂O₃ Additions on the Interfacial Behavior and Mechanical Properties of Eutectic Sn–9Zn Solder On Low Temperature Wetting and Soldering of 6061 Aluminum Alloys, J. Alloys Compd., 2017, 695, p 574–582CrossRef

20.

A.H. Nobari, M. Maalekian, K. Seelig et al., Effect of Sb on Wetting Behavior of Near Eutectic Sn–Cu Solder Micro-Alloyed with Ni and Ge, Solder. Surf. Mount Technol., 2016, 28(2), p 93–100CrossRef

21.

C.M. Chuang and K.L. Lin, Effect of Microelements Addition on the Interfacial Reaction Between Sn–Ag–Cu Solders and the Cu Substrate, J. Electron. Mater., 2003, 32(12), p 1426–1431CrossRef

22.

M.J. Esfandyarpour and R. Mahmudi, Microstructure and Tensile Behavior of Sn–5Sb Lead-Free Solder Alloy Containing Bi and Cu, Mater. Sci. Eng. A, 2011, 530, p 402–410CrossRef

Title: Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy
Authors: Kangli Li
Jian Lin
Tongju Wang
Yongping Lei
Hanguang Fu
Publication date: 16-07-2020
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 7/2020
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-020-04958-9

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Other articles of this Issue 7/2020

Computational Study of Fatigue in Sub-grain Microstructure of Additively Manufactured Alloys

Improved Edge Quality for AZ31 Sheets Using Online Heating Rolling Technique

Experimental Determination and Theoretical Prediction of Limiting Strains for ASS 316L at Hot Forming Conditions

Modeling of Metadynamic Recrystallization Kinetics and Recrystallization Mechanisms of V-Containing 12Cr Rotor Steel

Morphology Analysis and Characterization of Clinoptilolite/Polyvinylpyrrolidone-Zeolite Composite Nanofibers

High Temperature Deformation Behavior and Constitutive Modeling for Flow Behavior of Alloy 718

Premium Partners