Skip to main content
Top
Published in: Microsystem Technologies 9-11/2008

01-10-2008 | Technical Paper

Fabricating HARMS by using megasonic assisted electroforming

Authors: Gang Liu, Xinlong Huang, Ying Xiong, Yangchao Tian

Published in: Microsystem Technologies | Issue 9-11/2008

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Electroforming is a main fabrication method to produce metal microstructures for microelectromechanical systems. Since the mass transport is limited in high aspect ratio microstructures (HARMS), problems such as uneven filling and void formation are often involved in the electroplating of deep molds. In this work, megasonic agitation is employed to improve the electroplating of HARMS, which causes little damage to the resist structure and is thereby advantageous over ultrasonic agitation. Cantilever beams and gaps with a linewidth of 10 μm and an aspect ratio of 25 have been obtained. The main effects of megasonic agitation are analyzed. The results indicate that resonant bubbles in the electrolyte are probably responsible for the mass transport enhancement during the electroforming process.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literature
go back to reference Chen KS, Evans GH (2004) Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication. Microsyst Technol 10(6/7):444–450CrossRef Chen KS, Evans GH (2004) Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication. Microsyst Technol 10(6/7):444–450CrossRef
go back to reference Deymier PA, Vasseur JO, Khelif A et al (2001) Second-order sound field during megasonic cleaning of patterned silicon wafers: application to ridges and trenches. J Appl Phys 90(8):4211–4218CrossRef Deymier PA, Vasseur JO, Khelif A et al (2001) Second-order sound field during megasonic cleaning of patterned silicon wafers: application to ridges and trenches. J Appl Phys 90(8):4211–4218CrossRef
go back to reference Griffiths SK, Nilson RH, Bradshaw RW et al (1998) Transport limitations in electrodeposition for LIGA microdevice fabrication. Proc SPIE 3511:364–375CrossRef Griffiths SK, Nilson RH, Bradshaw RW et al (1998) Transport limitations in electrodeposition for LIGA microdevice fabrication. Proc SPIE 3511:364–375CrossRef
go back to reference Hyde ME, Compton RG (2002) How ultrasound influences the electrodeposition of metals. J Electroanal Chem 531:19–24CrossRef Hyde ME, Compton RG (2002) How ultrasound influences the electrodeposition of metals. J Electroanal Chem 531:19–24CrossRef
go back to reference Kupka RK, Bouamrane F, Cremers C et al (2000) Microfabrication: LIGA-X and applications. Appl Surf Sci 164:97–110CrossRef Kupka RK, Bouamrane F, Cremers C et al (2000) Microfabrication: LIGA-X and applications. Appl Surf Sci 164:97–110CrossRef
go back to reference Kuttruff H (1991) Ultrasonics, fundamentals and applications. Elsevier, New YorkMATH Kuttruff H (1991) Ultrasonics, fundamentals and applications. Elsevier, New YorkMATH
go back to reference Nilson RH, Griffiths SK (2002) Enhanced transport by acoustic streaming in deep trench-like cavities. J Electrochem Soc 149(4):G286–G296CrossRef Nilson RH, Griffiths SK (2002) Enhanced transport by acoustic streaming in deep trench-like cavities. J Electrochem Soc 149(4):G286–G296CrossRef
go back to reference Zanghellini J, Achenback S, El-Kholi A et al (1998) New development strategies for high aspect ratio microstructures. Microsyst Technol 4:94–97CrossRef Zanghellini J, Achenback S, El-Kholi A et al (1998) New development strategies for high aspect ratio microstructures. Microsyst Technol 4:94–97CrossRef
Metadata
Title
Fabricating HARMS by using megasonic assisted electroforming
Authors
Gang Liu
Xinlong Huang
Ying Xiong
Yangchao Tian
Publication date
01-10-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 9-11/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0556-1

Other articles of this Issue 9-11/2008

Microsystem Technologies 9-11/2008 Go to the issue