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Published in: Microsystem Technologies 9-11/2008

01-10-2008 | Technical Paper

Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off

Authors: Sven Achenbach, David Klymyshyn, Timo Mappes, Anton Kachayev, Venkat Subramanian, Garth Wells, Jürgen Mohr

Published in: Microsystem Technologies | Issue 9-11/2008

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Abstract

A submicron-scale surface acoustic wave (SAW) resonator fabricated by high-aspect-ratio X-ray lithography (XRL) and metal lift-off that operates at microwave frequencies is presented. We demonstrate that XRL is especially well suited for SAW device templating, as long submicron-scale interdigitated transducer structures can be batch patterned with excellent structure quality. 0.4–2.0 μm thick PMMA layers were structured by X-ray lithography shadow projection using silicon nitride-based X-ray masks. Structures with a critical lateral feature size of down to 200–700 nm were processed. The polymer structures served as templates in a subsequent aluminum lift-off process. The metal electrodes were successfully tested as SAW resonators for high frequency applications, e.g. around 1.3 GHz, using calibrated 1-port RF wafer probing measurements. Compared with standard fabrication techniques, the high structure quality of submicron-scale polymer templates made of unusually thick PMMA layers offers additional possibilities to fabricate thicker metal transducers.

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Literature
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Metadata
Title
Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off
Authors
Sven Achenbach
David Klymyshyn
Timo Mappes
Anton Kachayev
Venkat Subramanian
Garth Wells
Jürgen Mohr
Publication date
01-10-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 9-11/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0498-7

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