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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 4/2014

01-04-2014

Interdiffusion in the Cu–Pt system

Authors: Bibhudutta Mishra, Perumalsamy Kiruthika, Aloke Paul

Published in: Journal of Materials Science: Materials in Electronics | Issue 4/2014

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Abstract

Experiments are conducted to study interdiffusion in a complete solid solution as well as in ordered phases in the Cu–Pt system. The variation of the interdiffusion coefficient and the activation energy with composition of the solid solution is explained with the help of melting points, vacancy formation energies and thermodynamic factors indicating the driving force for diffusion. Additionally, interdiffusion coefficients are also estimated in the CuPt and Cu3Pt phases at two different temperatures.
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Metadata
Title
Interdiffusion in the Cu–Pt system
Authors
Bibhudutta Mishra
Perumalsamy Kiruthika
Aloke Paul
Publication date
01-04-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 4/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-1798-1

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