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Journal of Materials Science: Materials in Electronics

Published in:

01-10-2014

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

Authors: Peng Xue, Song-bai Xue, Yi-fu Shen, Fei Long, Hong Zhu

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2014

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Abstract

Growth kinetics of intermetallic compound layers (IMCs) formed between SnZnGa/SnZnGaNd solders for re-flow soldering and Cu substrate during aging was investigated at temperatures between 100 and 150 °C. The Cu₅Zn₈ IMCs could be found by reacting SnZnGa/SnZnGaNd solders on Cu substrate, and it was found that the addition of rare earth Nd can decrease the thickness of the IMCs of SnZn/Cu solder joints. The apparent activation energies of Cu₅Zn₈ which were calculated as 48.76 kJ/mol (SnZnGa) and 56.99 kJ/mol (SnZnGaNd). The shear force of Sn9Zn0.5Ga0.08Nd solder joint after aging treatment was remarkably higher than those of Sn–9Zn and Sn9Zn0.5Ga solder joints. The results would provide support to the superiority of Sn9ZnGaNd solder which can be used in the electronic packaging instead of traditional SnPb solder.

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Title: Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints
Authors: Peng Xue
Song-bai Xue
Yi-fu Shen
Fei Long
Hong Zhu
Publication date: 01-10-2014
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 10/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-014-2152-3

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