Skip to main content
Fachgebiete
Automobil + Motoren Bauwesen + Immobilien Business IT + Informatik Elektrotechnik + Elektronik Energie + Nachhaltigkeit Finance + Banking Management + Führung Marketing + Vertrieb Maschinenbau + Werkstoffe Versicherung + Risiko
DE
EN
Bücher
Zeitschriften
Themenseiten
Organisationspsychologie Projektmanagement Marketing Smart Manufacturing
Weitere Formate
Podcasts Webinare Technik Webinare Wirtschaft Kongresse Veranstaltungskalender Awards
Jetzt Einzelzugang starten
Zugang für Unternehmen
Referenzkunden
SLX-Digitalkonferenz: Zukunftswerkstatt 2024

Mehr Umsatz mit Top-Kontakten

Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
Erweiterte Suche
Anmelden
nach oben
Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 10/2014

01.10.2014

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

verfasst von: Peng Xue, Song-bai Xue, Yi-fu Shen, Fei Long, Hong Zhu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 10/2014

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Growth kinetics of intermetallic compound layers (IMCs) formed between SnZnGa/SnZnGaNd solders for re-flow soldering and Cu substrate during aging was investigated at temperatures between 100 and 150 °C. The Cu5Zn8 IMCs could be found by reacting SnZnGa/SnZnGaNd solders on Cu substrate, and it was found that the addition of rare earth Nd can decrease the thickness of the IMCs of SnZn/Cu solder joints. The apparent activation energies of Cu5Zn8 which were calculated as 48.76 kJ/mol (SnZnGa) and 56.99 kJ/mol (SnZnGaNd). The shear force of Sn9Zn0.5Ga0.08Nd solder joint after aging treatment was remarkably higher than those of Sn–9Zn and Sn9Zn0.5Ga solder joints. The results would provide support to the superiority of Sn9ZnGaNd solder which can be used in the electronic packaging instead of traditional SnPb solder.
Vorheriger Artikel Synthesis of Bi2Fe4O9/reduced graphene oxide composite by one-step hydrothermal method and its high photocatalytic performance
Nächster Artikel Lead-free piezoelectric composites with high piezoelectric performance and high dielectric constant caused by percolation phenomenon

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Jetzt informieren
Literatur
1.
J.X. Wang, S.B. Xue, Z.J. Han, S.L. Yu, Y. Chen, Y.P. Shi, H. Wang, Effect of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints. J. Alloys Compd. 467(1–2), 219–226 (2009)CrossRef
2.
M.M. Billah, K.M. Shorowordi, A. Sharif, Effect of micro size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties. J. Alloys Compd. 585, 32–39 (2014)CrossRef
3.
W.X. Chen, Effects of Ag, Ga, Al and Ce on the properties of Sn–9Zn lead-free solder [D]. Nanjing University of Aeronautics and Astronautics, (2010)
4.
C.M. Chen, Y.M. Hung, C.P. Lin, W.C. Su, Effect of temperature on microstructural changes of the Sn–9 wt% Zn lead-free solder stripe under current stressing. Mater. Chem. Phys. 115, 367–370 (2009)CrossRef
5.
H. Wang, S.B. Xue, F. Zhao, W.X. Chen, Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn–9Zn lead-free solder. J. Mater. Sci. Mater. Electron. 21, 111–119 (2010)CrossRef
6.
Hu Yu-hua, S-b Xue, Hui Wang, Huan Ye et al., Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder. J. Mater. Sci. Mater. Electron. 22, 481–487 (2011)CrossRef
7.
Y.H. Hu, S.B. Xue, H. Ye, Z.X. Xiao, L.L. Gao, G. Zeng, Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu joints with aging treatment. Mater. Des. 34, 768–775 (2012)CrossRef
8.
P. Xue, S.B. Xue, Y.F. Shen, H. Zhu, L.L. Gao, Study on properties of Sn–9Zn–Ga solder bearing Nd. J. Mater. Sci. Mater. Electron. 23(6), 1272–1278 (2012)
9.
L. Zhang, X.Y. Fan, C.W. He, Y.H. Guo, Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging. J. Mater. Sci. Mater. Electron. 24(9), 3249–3254 (2013)CrossRef
10.
M. Date, K.N. Tu, Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. J. Mater. Res. 19(10), 2887–2896 (2004)CrossRef
11.
S.M. Kuo, K.L. Lin, The hillock formation in a Cu/Sn–9Zn/Cu lamella upon current stressing. J. Electron. Mater. 36(10), 1378–1382 (2007)CrossRef
12.
L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)CrossRef
13.
J. Hu, A.M. Hu, M. Li, D.L. Mao, Depressing effect of 0.1wt% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Mater. Charact. 61, 355–361 (2010)CrossRef
14.
R. Mayappan, Z.A. Ahmad, Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder. Intermetallics 18, 730–735 (2010)CrossRef
15.
C.S. Lee, F.S. Shieu, Growth of intermetallic compounds in the Sn–9Zn/Cu joint [J]. J. Electron. Mater. 35(8), 1660–1664 (2006)CrossRef
16.
L.J. Liu, P. Wu, W. Zhou, Effects of Cu on the interfacial reactions between Sn–8Zn–3Bi–xCu solders and Cu substrate. Microelectron. Reliab. 54, 259–264 (2014)CrossRef
17.
D.G. Kim, H.S. Jung, S.B. Jung, Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate. Mater. Sci. Technol. 21(3), 381–386 (2005)CrossRef
18.
L. Zhang, J.G. Han, Y.H. Guo, C.W. He, Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM an experiments. Mater. Sci. Eng. A 597, 219–224 (2014)CrossRef
19.
L. Zhang, X.Y. Fan, Y.H. Guo, C.W. He, Properties enhancement of SnAgCu solders containing rare earth Yb. Mater. Des. 57, 646–651 (2014)CrossRef
Metadaten
Titel
Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints
verfasst von
Peng Xue
Song-bai Xue
Yi-fu Shen
Fei Long
Hong Zhu
Publikationsdatum
01.10.2014
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 10/2014
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2152-3

Weitere Artikel der Ausgabe 10/2014

Journal of Materials Science: Materials in Electronics 10/2014 Zur Ausgabe

OriginalPaper

Effect of film thickness and annealing on optical properties of TiO2 thin films and electrical characterization of MOS capacitors

OriginalPaper

Growth and characterization of indium phosphide nanowires on transparent conductive ZnO:Al films

Review

Low temperature sintering and characteristics of K2O–B2O3–SiO2–Al2O3 glass/ceramic composites for LTCC applications

OriginalPaper

Synthesis and microwave absorbing properties of Mn–Zn nanoferrite produced by microwave assisted ball milling

OriginalPaper

Giant dielectric properties of nanocrystalline Pb1−xSnxF2 solid solutions

OriginalPaper

Narrowing of ferromagnetic resonance linewidth in calcium substituted YIG powders by Zr4+/Sn4+ substitution

Neuer Inhalt

    Bildnachweise