Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Microsystem Technologies
Published in: Microsystem Technologies 9-11/2008

01-10-2008 | Technical Paper

Modelling of the filling of micro-cavities of finite geometry by amorphous polymers using hot-embossing

Authors: M. Sahli, C. Roques-Carmes, C. Khan Malek, J. C. Gelin

Published in: Microsystem Technologies | Issue 9-11/2008

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The possibility to fill cavities of finite geometry could be described using an analytical model of the hot-embossing process of viscoelastic polymers. This model is based on the volume conservation during the forming process which allows to predict data concerning the geometrical evolution of the material on one hand, and on the other hand the filling time of cavities in the mould. A particular attention was drawn on the necessary time to fill the cavities depending on their shape or a scale factor for a given cavity shape.
previous article High aspect ratio glass structures produced by means of the drawing technology
next article Control of the quality of laser surface texturing

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
Agassant J-F, Avenas P, Sergent J-Ph, Vergnes B, Vincent M (1996) La mise en forme des matériaux plastiques, 3rd édn. Lavoisier TEC&DOC, Paris
Becker H, Heim U (1999) Silicon as tool material for polymer hot embossing. In: Proceedings of the MEMS’99, Orlando, pp 228–232
Becker H, Dietz W (1998) Microfluidic devices for μ-TAS applications fabricated by polymer hot embossing. Process SPIE 3515:177–182CrossRef
Heckele M, Bacher W, M¨uller KD (1998) Hot embossing—the molding technique for plastic microstructures. Microsyst Technol 4:122–124CrossRef
Heckele M, Bacher W (1997) Modular hot embossing equipment for MEMS. Micromach Device 2:1–4
Heydermann LJ, Schift H, David C, Ketterer B, Auf der Maur M, Gobrecht J (2001) Nanofabrication using hot embossing lithography and electroforming. Microelectron Eng 57–58:375–80CrossRef
Moynihan S, Van Deun R, Binnemans K, Krueger J, Papen G von, Kewell A, Crean G, Redmond G (2007) Organo-lanthanide complexes as luminescent dopants in polymer waveguides fabricated by hot embossing. Opt Mater 29:1798–1808CrossRef
Sahli M, Roques-Carmes C, Duffait R, Khan Malek C (2005) Study of the rheological properties of poly(methylmethacrylate) (PMMA) and cyclo-olefin-copolymer (COC) to optimize the hot-embossing process. In: Menz W, Dimov S (eds) Proc. int. conf. on multi-material micro-manufacture (4M), Karlsruhe. Elsevier, Amsterdam, pp 83–86
Sahli M, Roques-Carmes C, Khan Malek C, Barrière T, Gelin JC (2006) Modelling the flow of a thermoplastic polymer to describe the filling of a cylindrical micro-cavity in the hot embossing process. In: Juster N, Rosochowski A (eds) Proc. 9th international ESAFORM conference on material forming. pp 563–566
Metadata
Title
Modelling of the filling of micro-cavities of finite geometry by amorphous polymers using hot-embossing
Authors
M. Sahli
C. Roques-Carmes
C. Khan Malek
J. C. Gelin
Publication date
01-10-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 9-11/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-008-0565-8

Other articles of this Issue 9-11/2008

Microsystem Technologies 9-11/2008 Go to the issue

Technical Paper

Soft X-ray lithography of high aspect ratio SU8 submicron structures

Technical Paper

Replication technologies for HARM devices: status and perspectives

Technical Paper

Micro injection molding for mass production using LIGA mold inserts

Technical Paper

Fabrication of Fresnel zone plates with high aspect ratio by soft X-ray lithography

Technical Paper

Study on demolding temperature in thermal imprint lithography via finite element analysis

Technical Paper

Measurement of side walls of high aspect ratio microstructures