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Open Access 01-11-2009

Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction

Authors: D. R. Shirley, J. K. Spelt

Title: Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
Authors: D. R. Shirley
J. K. Spelt
Publication date: 01-11-2009
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 11/2009
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-009-0901-5