Skip to main content
Top
Published in: Microsystem Technologies 3/2016

05-06-2015 | Technical Paper

Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum

Authors: Radoslav Rusanov, Holger Rank, Tino Fuchs, Roland Mueller-Fiedler, Oliver Kraft

Published in: Microsystem Technologies | Issue 3/2016

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

In this work we present a systematic investigation of various failure mechanisms for thin-film platinum heater structures and interdigitated electrodes as components of a resistive type soot particle sensor. We study the role of stress-migration and electromigration and their interaction for the reliability of these sensors. The influence of a titanium adhesion layer and gases from the ambient atmosphere are also studied. Lifetime determination and optical and scanning electron microscopy are applied for samples which have experienced different load conditions to understand qualitatively and quantitatively the phenomena. The aim of this work is to enable time-to-failure prediction and thus provide guidelines for limiting temperature and current density in the actual sensor to ensure its stability over lifetime. We use dedicated, application-related test structures to ensure that the results are applicable to sensor lifetime estimations.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literature
go back to reference Black JR (1969) Electromigration failure modes in aluminum metallization for semiconductor devices. Proc IEEE 57(9):1587–1594CrossRef Black JR (1969) Electromigration failure modes in aluminum metallization for semiconductor devices. Proc IEEE 57(9):1587–1594CrossRef
go back to reference Courbat J, Briand D, de Rooij NF (2008) Reliability improvement of suspended platinum-based micro-heating elements. Sens Actuators A 142:284–291CrossRef Courbat J, Briand D, de Rooij NF (2008) Reliability improvement of suspended platinum-based micro-heating elements. Sens Actuators A 142:284–291CrossRef
go back to reference Daves W (2013) Silicon carbide field-effect transistor (FET) transducers for harsh environment Applications. Shaker Verlag, p 59. ISBN 978-3-8440-1681-9 Daves W (2013) Silicon carbide field-effect transistor (FET) transducers for harsh environment Applications. Shaker Verlag, p 59. ISBN 978-3-8440-1681-9
go back to reference Firebaugh SL, Jensen KF, Schmidt MA (1998) Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus. J Micro Electro Mech Syst 7(1):128–135CrossRef Firebaugh SL, Jensen KF, Schmidt MA (1998) Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus. J Micro Electro Mech Syst 7(1):128–135CrossRef
go back to reference Garraud A, Combette P, Giani A (2013) Thermal stability of Pt/Cr and Pt/Cr2O3 thin-film layers on a SiNx/Si substrate for thermal sensor applications. Thin Solid Films 540:256–260CrossRef Garraud A, Combette P, Giani A (2013) Thermal stability of Pt/Cr and Pt/Cr2O3 thin-film layers on a SiNx/Si substrate for thermal sensor applications. Thin Solid Films 540:256–260CrossRef
go back to reference Hu C-K, Lee KY, Gignac L, Carruthers R (1997) Electromigration in 0.25 mm wide Cu line on W. Thin Solid Films 308–309:443–447CrossRef Hu C-K, Lee KY, Gignac L, Carruthers R (1997) Electromigration in 0.25 mm wide Cu line on W. Thin Solid Films 308–309:443–447CrossRef
go back to reference Hyun S, Kraft O, Vinci RP (2004) Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films. Acta Mater 52:4199–4211CrossRef Hyun S, Kraft O, Vinci RP (2004) Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films. Acta Mater 52:4199–4211CrossRef
go back to reference Johnson TV (2010) Review of diesel emissions and control. SAE Int J Fuels Lubr 3(1):16–29CrossRef Johnson TV (2010) Review of diesel emissions and control. SAE Int J Fuels Lubr 3(1):16–29CrossRef
go back to reference Laermer F, Schilp A (1996) Method of anisotropically etching silicon. United States Patent no. 5501893 Laermer F, Schilp A (1996) Method of anisotropically etching silicon. United States Patent no. 5501893
go back to reference Park JH, Ahn BT (2003) Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization. J Appl Phys 93(2):883–892CrossRef Park JH, Ahn BT (2003) Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization. J Appl Phys 93(2):883–892CrossRef
go back to reference Seah MP (1980) The quantitative analysis of surfaces by XPS: a review. Surf Interface Anal 2(6):222–239CrossRef Seah MP (1980) The quantitative analysis of surfaces by XPS: a review. Surf Interface Anal 2(6):222–239CrossRef
go back to reference Spannhake J, Schulz O, Helwig A, Krenkow A, Mueller G, Doll T (2006) High-temperature MEMS heater platforms: long-term performance of metal and semiconductor heater materials. Sensors 6:405–419CrossRef Spannhake J, Schulz O, Helwig A, Krenkow A, Mueller G, Doll T (2006) High-temperature MEMS heater platforms: long-term performance of metal and semiconductor heater materials. Sensors 6:405–419CrossRef
go back to reference Stapelberg RF (2009) Handbook of reliability, availability, maintainability and safety. Springer, Berlin, p 201MATH Stapelberg RF (2009) Handbook of reliability, availability, maintainability and safety. Springer, Berlin, p 201MATH
go back to reference Tao J, Cheung NW, Hu C (1993) Electromigration characteristics of copper interconnects. IEEE Electron Device Lett 14(5):249–251CrossRef Tao J, Cheung NW, Hu C (1993) Electromigration characteristics of copper interconnects. IEEE Electron Device Lett 14(5):249–251CrossRef
go back to reference Thompson CV (1990) Grain growth in thin films. Annu Rev Mater Sci 20:245–268CrossRef Thompson CV (1990) Grain growth in thin films. Annu Rev Mater Sci 20:245–268CrossRef
Metadata
Title
Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum
Authors
Radoslav Rusanov
Holger Rank
Tino Fuchs
Roland Mueller-Fiedler
Oliver Kraft
Publication date
05-06-2015
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 3/2016
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2576-6

Other articles of this Issue 3/2016

Microsystem Technologies 3/2016 Go to the issue