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Journal of Materials Science: Materials in Electronics

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01-03-2007

Sn–Zn low temperature solder

Authors: Katsuaki Suganuma, Kuen-Soo Kim

Published in: Journal of Materials Science: Materials in Electronics | Issue 1-3/2007

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Abstract

Low temperature soldering is one of the key technologies before the accomplishment of total lead-free conversion in electronics industries. While Sn-Zn eutectic alloy has excellent properties as low temperature solder, it has some drawbacks. Damage by heat exposure and corrosion in humidity are two of the main concerns. Zn has an important role in chemical properties. The material physical properties, wetting, chemical stabilities and various reliabilities have been well understood on this alloy system through the numerous past works. The understanding of both materials and processing aspects enables one to manufacture sound electronic products without any serious problems. The basic properties and the current understandings on the limit of the application of this solder are reviewed in this paper.

previous article Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

next article Composite lead-free electronic solders

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K. Suganuma, T. Kiga, M. Takeuchi, Q. Yu, K. Tanabe, K. Toi, H. Tanaka, Y. Kato, K. Sasaki, K. Takahashi, M. Tadauchi, T. Tsukui, T. Suga, T. Makimoto, Current Technology of Low Temperature Lead-Free Soldering and JIEP Project, International Conference on Lead Free Electronics “Towards Implementation of the RoHS Directive”, IPC/SolderTech, Brussels, June 10–11, 2003, pp. 97–104

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K. Suganuma, T. Imanishi, K.S. Kim, M.Ueshima, Properties of low temperature solder Sn–Ag–In–Bi, presented at Materials Science & Technology 2005 Conference and Exhibition (MS&T’05), TMS, Pittsburgh, USA, Sep. 25–28, 2005

Title: Sn–Zn low temperature solder
Authors: Katsuaki Suganuma
Kuen-Soo Kim
Publication date: 01-03-2007
Publisher: Kluwer Academic Publishers-Plenum Publishers
Published in: Journal of Materials Science: Materials in Electronics / Issue 1-3/2007
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-006-9018-2

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Other articles of this Issue 1-3/2007

Processing and material issues related to lead-free soldering

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments

Tin pest issues in lead-free electronic solders

Composite lead-free electronic solders

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders