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Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
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Journal of Materials Science: Materials in Electronics

Ausgabe 1-3/2007

Special Issue: Lead-Free Electronic Solders Guest Editor: K. N. Subramanian

Inhalt (24 Artikel)

Preface

K. N. Subramanian

Thermodynamics and phase diagrams of lead-free solder materials

H. Ipser, H. Flandorfer, Ch. Luef, C. Schmetterer, U. Saeed

Phase Diagrams of Pb-Free Solders and their Related Materials Systems

Sinn-Wen Chen, Chao-Hong Wang, Shih-Kang Lin, Chen-Nan Chiu

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

D. Swenson

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson

Rare-earth additions to lead-free electronic solders

C. M. L. Wu, Y. W. Wong

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Paul T. Vianco, Jerome A. Rejent, Arlo F. Fossum, Michael K. Neilsen

Sn–Zn low temperature solder

Katsuaki Suganuma, Kuen-Soo Kim

Composite lead-free electronic solders

Fu Guo

Processing and material issues related to lead-free soldering

Laura J. Turbini

Interfacial reaction issues for lead-free electronic solders

C. E. Ho, S. C. Yang, C. R. Kao

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

N. Chawla, R. S. Sidhu

Deformation behavior of tin and some tin alloys

Fuqian Yang, J. C. M. Li

Mechanical fatigue of Sn-rich Pb-free solder alloys

J. K. Shang, Q. L. Zeng, L. Zhang, Q. S. Zhu

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

Michael Osterman, Abhijit Dasgupta

Original Paper

Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments

K. N. Subramanian

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul S. Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi N. Ramanathan

Electromigration issues in lead-free solder joints

Chih Chen, S. W. Liang

Stress analysis of spontaneous Sn whisker growth

K. N. Tu, Chih Chen, Albert T. Wu

Sn-whiskers: truths and myths

J. W. Osenbach, J. M. DeLucca, B. D. Potteiger, A. Amin, F. A. Baiocchi

Tin pest issues in lead-free electronic solders

W. J. Plumbridge

Issues related to the implementation of Pb-free electronic solders in consumer electronics

D. R. Frear

Impact of the ROHS directive on high-performance electronic systems

Karl J. Puttlitz, George T. Galyon

Impact of the ROHS Directive on high-performance electronic systems

Karl J. Puttlitz, George T. Galyon

Dez 06
Ausgabe: 12/2006
Apr 07
Ausgabe: 4/2007

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