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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1-3/2007

01.03.2007

Phase Diagrams of Pb-Free Solders and their Related Materials Systems

verfasst von: Sinn-Wen Chen, Chao-Hong Wang, Shih-Kang Lin, Chen-Nan Chiu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1-3/2007

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Abstract

Replacing Pb–Sn with Pb-free solders is one of the most important issues in the electronic industry. Melting, dissolution, solidification and interfacial reactions are encountered in the soldering processes. Phase diagrams contain equilibrium phase information and are important for the understanding and prediction of phase transformation and reactive phase formation at the solder joints. This study reviews the available phase diagrams of the promising Pb-free solders, and their related materials systems. The solders are Sn–Ag, Sn–Cu, Sn–Ag–Cu, Sn–Zn, Sn–Bi, Sn–In and Sn–Sb. The materials systems are the solders with the Ag, Au, Cu, Ni substrates, such as Sn–Ag–Au, Sn–Ag–Ni, Sn–Cu–Au, and Sn–Cu–Ni ternary systems. For the Pb-free solders and their related ternary and quaternary systems, preliminary phase equilibria information is available; however, complete and reliable phase diagrams over the entire compositional and temperature ranges of soldering interests are lacking.
Vorheriger Artikel Thermodynamics and phase diagrams of lead-free solder materials
Nächster Artikel The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

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Metadaten
Titel
Phase Diagrams of Pb-Free Solders and their Related Materials Systems
verfasst von
Sinn-Wen Chen
Chao-Hong Wang
Shih-Kang Lin
Chen-Nan Chiu
Publikationsdatum
01.03.2007
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1-3/2007
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-9010-x

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