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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1-3/2007

01.03.2007

Deformation behavior of tin and some tin alloys

verfasst von: Fuqian Yang, J. C. M. Li

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1-3/2007

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Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
Vorheriger Artikel Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
Nächster Artikel Mechanical fatigue of Sn-rich Pb-free solder alloys

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Metadaten
Titel
Deformation behavior of tin and some tin alloys
verfasst von
Fuqian Yang
J. C. M. Li
Publikationsdatum
01.03.2007
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1-3/2007
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-9016-4

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