Top

Journal of Materials Science: Materials in Electronics

Published in:

01-03-2007

Deformation behavior of tin and some tin alloys

Authors: Fuqian Yang, J. C. M. Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 1-3/2007

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.

previous article Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

next article Mechanical fatigue of Sn-rich Pb-free solder alloys

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 340 Zeitschriften

aus folgenden Fachgebieten:

Bauwesen + Immobilien
Business IT + Informatik
Finance + Banking
Management + Führung
Marketing + Vertrieb
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

L.C. Tyte, Proc. Roy. Soc. 50, 193 (1938)

K. Löhberg, H. Moustafa, Zeitschrift für Metallkunde 67(5), 333 (1976)

S.N.G. Chu, J.C.M. Li, Mater. Sci. Eng. 39, 1 (1979)

B. Akdim, D.A. Papaconstantopoulos, M.J. Mehl, Phil. Mag. B 82, 47 (2002)

K.N. Subramanian, J.G. Lee, Mat. Sci. Eng. A421, 46 (2006)

C.S. Barrett in Metallurgy and Metallurgical Engineering Series, ed. by R. F. Mehl, 2nd edn. (McGraw-Hill, New York, 1952), pp. 337–379 (see also Metals Handbook, American Society for Metals, Metals Park, OH, 1948, p. 1071)

E. Schmid, W. Boas, Plasticity (Chapman-Hall, London, 1968)

M. Lorenz, Zeitschrift für Metallkunde 59, 419 (1968)

H. Mark, M. Polanyi, Z. Physik 18, 75 (1923)

10.

J. Obinata, E. Schmid, Z. Physik 82, 224 (1933)

11.

J. Weertman, J.E. Breen, J. Appl. Phys. 27, 1189 (1956)

12.

G.I. Kirichenko, V.P. Soldatov, Fizika Metallov I Metallovedenie 54(3) 560 (1982) Translation, Phys. Met. Metall. 54, 130 (1982)

13.

K. Ojima, T. Hirokawa, Jpn. J. Appl. Phys., Part 1 (Regular Papers & Short Notes), 22, 46 (1983)

14.

M. Nagasaka, Jpn. J. Appl. Phys., Part 1 (Regular Papers & Short Notes), 28, 446 (1989)

15.

R. Fiedler, A.R. Lang, J. Mat. Sci. 7, 531 (1972)

16.

R. Fiedler, I. Vagera, Phys. Status Solidi A32, 419 (1975)

17.

A.N. Stroh, Phil. Mag. 3, 625 (1958)CrossRef

18.

B. Duzgun, I. Aytas, Jpn. J. Appl. Phys. Part 1-Regular Papers Short Notes & Review Papers 32, 3214 (1993)

19.

K. Honda, Jpn. J. Appl. Phys. 17, 33 (1978)

20.

K. Honda, Jpn. J. Appl. Phys. 18, 215 (1979)

21.

K. Honda, Jpn. J. Appl. Phys. 26, 637 (1987)

22.

L. Rotherham, A.D.N. Smith, G.B. Greenough, J. Inst. Metals 79, 439 (1951)

23.

E. Fraizier, M.H. Nadal, R. Oltra, Jpn. J. Appl. Phys. 93, 649 (2003)

24.

I. Takamichi, I.L. Roderick, The Physical Properties of Liquid Metals, vol. 1 (Clarendon, Oxford, 1988), p. 71, Chapter 3

25.

V.M. Mathew, C.S. Menon, K.P. Jayachandran, J. Phys. Chem. Solids 63, 1835 (2002)

26.

W.P. Mason, H.E. Bommel, J. Acoust. Soc. Am. 28, 930 (1956)

27.

P.W. Bridgeman, Proc. Natl Acad. Sci. USA 10, 411 (1924)

28.

K.D. Swartz, W.B. Chua, C. Elbaum, Phys. Rev. B 6, 426 (1972)

29.

R.R. Rao, A. Padmaja, J. Appl. Phys. 62, 15 (1987)

30.

P.J. Fensham, Aust. J. Sci. Res. 3A, 91 (1950)

31.

J.D. Meakin, E. Klokholm, Trans. Met. Soc. AIME 218, 463 (1960)

32.

W. Chomka, J. Andruszkiewicz, Nucleonica 5 611 (1960) Translation, pp. 521–524

33.

C. Coston, N.H. Nachtrieb, J. Phys. Chem. 8, 2219 (1964)

34.

G. Pawlicki, Nukleonica 12, 1123 (1967), Translation pp. 45–56

35.

J.C.M. Li, in Rate Processes in Plastic Deformation of Materials, ed. by J.C.M. Li, A.K. Mukherjee (American Soc. Metals, Metals Park, OH, 1975), p. 475

36.

K.L. Devries, G.S. Baker, P. Gibbs, J. Appl. Phys. 34, 2258 (1963)

37.

V.D. Natsik, V.P. Soldatov, L.G. Ivanchenko, G.I. Kirichenko, Low Temp. Phys. 30(3), 253 (2004)

38.

V.P. Soldatov, V.D. Natsik, G.I. Kirichenko, Low Temp. Phys. 27, 1048 (2001)

39.

V.D. Natsik, V.P. Soldatov, G.I. Kirichenko, L.G. Ivanchenko, Low Temp. Phys. 29, 340 (2003)

40.

G.I. Kirichenko, V.D. Natsik, V.P. Soldatov, Fizika Nizkikh Temperatur 18(11), 1270 (Nov. 1992) Transloation: Sov. J. Low Temp. Phys. 18, 887 (1992)

41.

A.N. Diulin, G.I. Kirichenko, V.D. Natsik et al., Low Temp. Phys. 24, 452 (1998)

42.

M. Fujiwara, T. Hirokawa, Jpn. J. Appl. Phys., Part 1 (Regular Papers & Short Notes), 25, 1598 (1986)

43.

M. Fujiwara, Mater. Sci. Eng. A - Struct. Mater. Prop. Microstruct. Proce. 234, 991 (1997)

44.

M. Nagasaka, Jpn. J. Appl. Phys. Part 1-Regular Papers Short Notes & Review Papers 38(1A), 171 (1999)

45.

A.E. Ekinci, N. Ucar, G. Cankaya, B. Duzgun, Indian J. Eng. Mater. Sci. 10(5), 416 (2003)

46.

J.E. Breen, J. Weertman, Trans. Am. Instit. Min. Metall. Eng. 203(11), 1230 (1955)

47.

J. Weertman, J. Appl. Phys. 28(2), 196 (1957)

48.

R.E. Frenkel, O.D. Sherby, J.E. Dorn, Acta Metall. 3, 470 (1955)

49.

K.E. Puttick, R. King, J. Inst. Metals 80, 537 (1952)

50.

C.D. Wiseman, O.D. Sherby, J.E. Dorn, Trans. AIME, J. Metals 9, 57 (1957)

51.

L.G. Bonar, G.B. Craig, Can. J. Phys. 36, 1445 (1958)

52.

O.D. Sherby, J.E. Dorn, Trans. AIME 194, 959 (1952)

53.

S.H. Suh, J.B. Cohen, J. Weertman, Scripta Metall. 15, 517 (1981)

54.

S.H. Suh, J.B. Cohen, J. Weertman, Metall. Trans. A-Phys. Metall. Mater. Sci. 14, 117 (1983)

55.

P. Adeva, G. Caruana, O.A. Ruano et al., Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Proce. 194, 17 (1995)

56.

R.J. McCabe, M.E. Fine, Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 33, 1531 (2002)

57.

M.D. Mathew, H.H. Yang, S. Movva, K.L. Murty, Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 36A, 99 (2005)

58.

F. Garofalo, Fundamentals of Creep and Creep-Rapture in Metals (Macmillan, NY 1966), p. 101

59.

C. Park, X. Long, S. Hoberman, S. Ma, I. Dutta, J. Mat. Sci. to appear (2006)

60.

X. Long, D. Pan, I. Dutta, unpublished

61.

E.C. Yu, J.C.M. Li, Phil. Mag. 36, 811 (1977)

62.

H.Y. Yu, J.C.M. Li, J. Mat. Sci. 12, 2214 (1977)

63.

J.C.M. Li, Mat. Sci. Eng. A322, 23 (2002)

64.

M.J. Mayo, W.D. Nix, Acta Metall. 36, 2183 (1988)

65.

V. Raman, R. Berriche, J. Mater. Res. 7, 627 (1992)

66.

M. Fujiwara, M. Otsuka, Mater. Sci. Eng. A - Struct. Mater. Prop. Microstruct. Proce. 319, 929 (2001)

67.

M. Fujiwara, M. Otsuka, J. Jpn. Instit. Metals 63, 760 (1999)

68.

T.S. Kê, Phys. Rev. 71, 533 (1947)

69.

T.S. Kê, Phys. Rev. 72, 41 (1947)

70.

T.S. Kê, Phys. Rev. 73, 267 (1948)

71.

T.S. Kê, J. Appl. Phys. 20, 274 (1949)

72.

F.A. Mohamed, K.L. Murty, J.W. Morris, Metall. Trans. 4, 935 (1973)

73.

W.A. Zama, D.D. Lang, F.R. Brotzen, J. Mech. Phys. Solids 8, 45 (1960)

74.

Japanese Ministry of Health and Welfare Waste Regulation (1998)

75.

European Union WEEE Directive, 3rd draft ed. (2000)

76.

W.J. Plumbridge, C.R.C.R. Gagg, J. Mat. Sci. Mat. Electr. 10, 461 (1999)

77.

M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, T. Shibuya, Microelectr. Reliab. 42, 951 (2002)

78.

M.L. Huang, L. Wang, C.M.L. Wu, J. Mat. Res. 17, 2897 (2002)

79.

J. Cadek, Creep in Metallic Materials (Amsterdam, Elsevier, The Netherlands, 1988), p. 44

80.

J. Yu, D.K. Joo, S.W. Shin, Acta Met. 50, 4315 (2002)

81.

K.S. Kim, S.H. Huh, K. Suganuma, Mat. Sci. Eng. A333, 106 (2002)

82.

P.T. Vianco, J.A. Rejent, A.C. Kilgo, J. Electr. Mat. 33, 1389 (2004)

83.

P.T. Vianco, J.A. Rejent, A.C. Kilgo, J. Electr. Mat. 33, 1473 (2004)

84.

P.T. Vianco, J.A. Rejent, A.C. Kilgo, J. Electr. Mat. 32, 142 (2003)

85.

P.T. Vianco, J.A. Rejent, J.J. Martin, J. Metals 55, 50 (2003)

86.

S. Wiese, K.J. Wolter, Microelectr. Reliab. 44, 1923 (2004)

87.

M.M. El-Bahay et al., J. Mat. Sci. Electr. Mat. 15, 519 (2004)

88.

I. Shohji, T. Yoshida, T. Takahashi, S. Hioki, Mat. Sci. Eng. A 366, 50 (2004)

89.

F.Q. Lang, H. Tanaka, O. Munegata, T. Taguchi, T. Narita, Mater. Charact. 54, 223 (2005)

90.

C.H. Lin, D.Y. Chu, J. Mat. Sci. Electr. Mat. 16, 355 (2005)

91.

F. Guo, J.P Lucas, K.N. Subramanian, J. Mat. Sci. Mat. Electr. 12, 27 (2001)

92.

F. Guo, J. Lee, J.P. Lucas, K.N. Subramanian, T.R. Bieler, J. Electr. Mat. 30, 1222 (2001)

93.

S.G. Jadhav, T.R. Bieler, K.N. Subramanian, J.P. Lucas, J. Electr. Mat. 30, 1197 (2001)

94.

H. Rhee, K.N. Subramanian, J. Electr. Mat. 32, 1310 (2003)

95.

H. Rhee, K.N. Subramanian, A. Lee, J.G. Lee, Solder. Surface Mount Technol. 15, 21 (2003)

96.

S. Wiese, F. Feustel, E. Meusel, Sens. Actuators A99, 188 (2002)

97.

F. Guo, S. Choi, K.N. Subramanian, T.R. Bieler, J.P. Lucas, A. Achari, M. Paruchuri, Mat. Sci. Eng. A351, 190 (2003)

98.

M. Kerr, N. Chawla, Acta Mater. 52, 4527 (2004)

99.

J.P. Lucas, H. Rhee, F. Guo, K.N. Subramanian, J. Electr. Mat. 32, 1375–1383 (2003)

100.

I. Dutta, C. Park, S. Choi, Mat. Sci. Eng. A 379, 401 (2004)

101.

F.Q. Yang, L.L. Peng, Mat. Sci. Eng. A 409, 87 (2005)

102.

I. Dutta, D. Pan, R.A. Marks, S.G. Jadhav, Mat. Sci. Eng. A 410–411, 48 (2005)

103.

F.Q. Yang, J.C.M. Li, Mat. Sci. Eng. A 201, 40 (1995)

104.

D. Pan, R.A. Marks, I. Dutta, R. Mahajan, S.G. Jadhav, Rev. Sci. Instrum. 75, 5244 (2004)

105.

H.J. Frost, M.F. Ashby, Deformation Mechanism Maps—The Plasticity and Creep of Metals and Ceramics (Pergaman, Oxford, 1982), p. 21

106.

R.K. Mahidhara, S.M.L. Sastry, I. Turlik, K.L. Murty, Scripta Met. Mat. 31, 1145 (1994)

107.

F.A. Sadykov, N.P. Barykin, I.S. Valeev, V.N. Danilenko, J. Mater. Eng. Perform. 12(1), 29 (2003)

108.

K. Yomogita, Jpn. J. Appl. Phys. 9, 1437 (1970)

109.

A.Z. Mohamed, M.S. Saker, A.M.A. Daiem et al., Phys. Status Solidi A-Appl. Res. 133, 51 (1992)

110.

R. Clark, G.B. Craig, B. Chalmers, Acta Crystallogr. 3(6), 479 (1950)

111.

E. Schmid, W. Boas, Kristallplastizitat (Springer, Berlin, 1935)

112.

C.S. Barrett, Structure of Metals (McGraw-Hill, New York, 1943)

113.

C.E. Elam, Distortion of Metal Crystals (Clarendon Press, Oxford, 1935)

114.

B. Chalmers, Proc. Phys. Soc. 47, 733 (1935)

115.

J.K. Lee, M.H. Yoo, Metall. Trans. A (Phys. Metall. Mater. Sci.) 21A, 2521–2530 (1990)

116.

K. Ishii, H. Kiho, J. Phys. Soc. Jpn. 18, 1122 (1963)

117.

J.D. Eshelby, Prog. Solid Mech. 2, 89 (1961)

118.

T. Mura, Micromechanics of Defects in Solids, 2nd edn. (Martinus Nijhoff, Dordrecht, The Netherlands, 1987), Chapter 4

119.

R. Clark, G.B. Craig, Progr. Metal Phys. 3, 135 (1952)

120.

E. Votava, H. Hatwell, Acta Met. 8, 874 (1960)

121.

J.T. Fourie, F. Weinberg, F.W.C. Boswell, Acta Metall. 8, 851 (1960)

122.

K. Ishii, J. Phys. IV 6(C8), 269–272 (1996)

123.

J.H. Brunton, M.P.W. Wilson, Proce. Roy. Soc. Lond. Ser. A-Mathemat. Phys. Sci. A 309(#1498), 345 (1969)

124.

W.P. Mason, H.J. Mcskimin, W. Shockley, Phys. Rev. 73, 1213 (1948)

125.

K. Ishii, H. Kiho, J. Phys. Soc. Jpn. 18, 1133 (1963)

126.

K. Ishii, J. Phys. Soc. Jpn. 14, 1315 (1959)

127.

S. Maruyama, J. Phys. Soc. Jpn. 15, 1243 (1960)

128.

M.G. Jon, D.N. Beshers, W.P. Mason, J. Appl. Phys. 45(9), 3716 (1974)

129.

D.R. Overcash, E.P. Stillwel, M.J. Skove, J.H. Davis, Philos. Mag. 25, 1481 (1972)

130.

K.N. Tu, D. Turnbull. J. Metals 21, A18 (1969)

131.

K.N. Tu, D. Turnbull, Acta Metall. 17(10), 1263 (1969)

132.

B.D. Rothberg, Philos. Mag. 25, 1473 (1972)

133.

J.H. Davis, M.J. Skove, E.P. Stillwell, Solid State Comm. 4, 597 (1966)

Title: Deformation behavior of tin and some tin alloys
Authors: Fuqian Yang
J. C. M. Li
Publication date: 01-03-2007
Publisher: Kluwer Academic Publishers-Plenum Publishers
Published in: Journal of Materials Science: Materials in Electronics / Issue 1-3/2007
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-006-9016-4

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Springer Professional "Wirtschaft"

Other articles of this Issue 1-3/2007

Composite lead-free electronic solders

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

Impact of the ROHS Directive on high-performance electronic systems

Tin pest issues in lead-free electronic solders

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications