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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 1-3/2007

01-03-2007

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Author: Iver E. Anderson

Published in: Journal of Materials Science: Materials in Electronics | Issue 1-3/2007

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Abstract

The global electronic assembly community is striving to accommodate the replacement of Pb-containing solders, primarily Sn–Pb alloys, with Pb-free solders due to environmental regulations and market pressures. Of the Pb-free choices, a family of solder alloys based on the Sn–Ag–Cu (SAC) ternary eutectic (T eut. = 217°C) composition have emerged with the most potential for broad use across the industry, but the preferred (typically near-eutectic) composition is still in debate. This review will attempt to clarify the characteristic microstructures and mechanical properties of the current candidates and recommend alloy choices, a maximum operating temperature limit, and directions for future work. Also included in this review will be an exploration of several SAC + X candidates, i.e., 4th element modifications of SAC solder alloys, that are intended to control solder alloy undercooling and solidification product phases and to improve the resistance of SAC solder joints to high temperature thermal aging effects. Again, preliminary alloy recommendations will be offered, along with suggestions for future work.
previous article The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
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Metadata
Title
Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
Author
Iver E. Anderson
Publication date
01-03-2007
Published in
Journal of Materials Science: Materials in Electronics / Issue 1-3/2007
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-9011-9

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