Top

Journal of Materials Science: Materials in Electronics

Published in:

01-03-2007

Phase Diagrams of Pb-Free Solders and their Related Materials Systems

Authors: Sinn-Wen Chen, Chao-Hong Wang, Shih-Kang Lin, Chen-Nan Chiu

Published in: Journal of Materials Science: Materials in Electronics | Issue 1-3/2007

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

Replacing Pb–Sn with Pb-free solders is one of the most important issues in the electronic industry. Melting, dissolution, solidification and interfacial reactions are encountered in the soldering processes. Phase diagrams contain equilibrium phase information and are important for the understanding and prediction of phase transformation and reactive phase formation at the solder joints. This study reviews the available phase diagrams of the promising Pb-free solders, and their related materials systems. The solders are Sn–Ag, Sn–Cu, Sn–Ag–Cu, Sn–Zn, Sn–Bi, Sn–In and Sn–Sb. The materials systems are the solders with the Ag, Au, Cu, Ni substrates, such as Sn–Ag–Au, Sn–Ag–Ni, Sn–Cu–Au, and Sn–Cu–Ni ternary systems. For the Pb-free solders and their related ternary and quaternary systems, preliminary phase equilibria information is available; however, complete and reliable phase diagrams over the entire compositional and temperature ranges of soldering interests are lacking.

previous article Thermodynamics and phase diagrams of lead-free solder materials

next article The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 340 Zeitschriften

aus folgenden Fachgebieten:

Bauwesen + Immobilien
Business IT + Informatik
Finance + Banking
Management + Führung
Marketing + Vertrieb
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

R.J. Klein Wassink, in Soldering in Electronics, 2nd edn. (Electrochemical Publications, Isle of Man, 1989)

Official Journal of the European Union, p. L 37/19-L 37/23, 13.2.2003

J. Bath, C. Handwerker, E. Bradley, Circ. Assembly 5, 31 (2000)

M. Abtew, G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000)

T. Laurila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005)

D.R. Frear, W.B. Jones, K.R. Kinsman, in Solder Mechanics: A State of the Art Assessment (Minerals, Metals & Materials Society, Warrendale, Pa, 1991)

“Roadmap 2002 for Commercialization of Lead-free Solder”, Lead-Free Soldering Roadmap Committee, Japan Electronics and Information Technology industries Association (JEITA) (2002)

“Lead-free Assembly Projects”, National Electronics Manufacturing Initiatives(NEMI) (1999)

I. Karakaya, W.T. Thompson, Bull. Alloy Phase Diagrams 8, 340 (1987)

10.

U.R. Kattner, W.J. Boettinger, J. Electron. Mater. 23, 603 (1994)

11.

N. Saunders, A.P. Miodownik, Bull. Alloy Phase Diagrams 11, 278 (1990)

12.

J.H. Shim, C.S. Oh, B.J. Lee, D.N. Lee, Z. Metallkd. 87, 205 (1996)

13.

W.J. Boettinger, C.A. Handwerker, U.R. Kattner, in The Mechanics of Solder Alloy Wetting and Spreading (Van Nostrand Reinhold, New York, 1993), p. 103

14.

E. Gebhardt, G. Petzow, Z. Metallkd. 50, 597 (1959)

15.

Y.W. Yen, S.-W. Chen, J. Mater. Res. 19, 2298 (2004)

16.

C.M. Miller, I.E. Anderson, J.F. Smith, J. Electron. Mater. 23, 595 (1994)

17.

M.E. Loomans, M.E. Fine, Metall. Trans. A 31, 1155 (2000)

18.

K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwereker, J. Electron. Mater. 29, 1122 (2000)

19.

I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, R. Kainuma, K. Ishida, J. Electron. Mater. 29, 1137 (2000)

20.

T.B. Massalski, H. Pops, Acta Metall. 18, 961 (1970)

21.

D.S. Evans, A. Prince, Met. Sci. 8, 286 (1974)

22.

S.-W. Chen, Y.W. Yen, J. Electron. Mater. 30, 1133 (2001)

23.

J. London, D.W. Ashall, Brazing Solder. 11, 49 (1986)

24.

P.T. Vianco, K.L. Erickson, P.L. Hopkins, J. Electron. Mater. 23, 721 (1994)

25.

S.-W. Chen, Y.W. Yen, J. Electron. Mater. 28, 1203 (1999)

26.

S. Choi, T.R. Bieler, J.P. Lucas, K.N. Subramanian, J. Electron. Mater. 28, 1209 (1999)

27.

T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, J.K. Kivilahti, J. Mater. Res. 17, 291 (2002)

28.

H.F. Hsu, S.-W. Chen, Acta Mater. 52, 2541 (2004)

29.

S.-W. Chen, H.F. Hsu, C.W. Lin, J. Mater. Res. 19, 2262 (2004)

30.

H.D. Blair, T.Y. Pan, J.M. Nicholson, in Proceedings of the 48th Electronic Components and Technology Conference, 1998 p. 259

31.

C.M. Chen, S.-W. Chen, J. Appl. Phys. 90, 1208 (2001)

32.

C.E. Ho, R.Y. Tsai, Y.L. Lin, C.R. Kao, J. Electron. Mater. 31, 584 (2002)

33.

C.C. Chen, S.-W. Chen, C.Y. Kao, J. Electron. Mater. 35, 922 (2006)

34.

O.B. Karlsen, A. Kjekshus, E. Roest, Acta Chem. Scand. 46, 147 (1992)CrossRef

35.

B. Peplinski, E. Zakel, Mater. Sci. Forum 166–169, 443 (1994)CrossRef

36.

C.N.C. Luciano, K.I. Udoh, M. Nakagawa, S. Matsuya, M. Ohta, J. Alloys Comp. 337, 289 (2002)

37.

C.E. Ho, Y.M. Chen, C.R. Kao, J. Electron. Mater. 28, 1231 (1999)

38.

C.H. Lin, S.-W. Chen, C.H. Wang, J. Electron. Mater. 31, 907 (2002)

39.

C.H. Wang, S.-W. Chen, Metall. Trans. A 34, 2281 (2003)

40.

S.-W. Chen, S.H. Wu, S.W. Lee, J. Electron. Mater. 32, 1188 (2003)

41.

Y. Murakami, S. Kachi, Trans. JIM. 24, 9 (1983)

42.

P. Oberndorff, PhD Thesis, Technical University of Eindhoven, Eindhoven, Nerthelands (2001)

43.

J. Miettinen, CALPHAD 27, 309 (2003)

44.

J.K. Lin, A. De Silva, D. Frear, Y. Guo, J.W. Jang, L. Li, D. Mitchell, B. Yeung, C. Zhang, in Proceedings of the 51st Electronic Components and Technology Conference, 2001 p. 455

45.

W.T. Chen, C.E. Ho, C.R. Kao, J. Mater. Res. 17, 263 (2002)

46.

S.-W. Chen, S.W. Lee, M.C. Yip, J. Electron. Mater. 32, 1284 (2003)

47.

C.H. Wang, S.-W. Chen, Acta Mater. 54, 247 (2006)

48.

S.-W. Chen, C.A. Chang, J. Electron. Mater. 33, 1071 (2004)

49.

C.A. Chang, S.-W. Chen, C.N. Chiu, Y.C. Huang, J. Electron. Mater. 34, 1135 (2005)

50.

C.N. Chiu, Y.C. Huang, A.R. Zi, S.-W. Chen, Mater. Trans. 46, 2426 (2005)

51.

A. Zribi, A. Clark, L. Zavalij, P. Borgesen, E.J. Cotts, J. Electron. Mater. 30, 1157 (2001)

52.

K. Zeng, V. Vuorinen, J.K. Kivilahti, IEEE Trans. Electron. Packag. Manufact. 25, 162 (2002)

53.

K.S. Kim, S.H. Huh, K. Suganuma, J. Alloys Comp. 352, 226 (2003)

54.

M.D. Cheng, S.Y. Chang, S.F. Yen, T.H. Chuang, J. Electron. Mater. 33, 171 (2004)

55.

W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, C.R. Kao, Mater. Sci. Eng. A 396, 385 (2005)

56.

U.R. Kattner, JOM 49(12), 14 (1997)

57.

H.T. Luo, S.-W. Chen, J. Mater. Sci. 31, 5059 (1996)

58.

Z. Moser, J. Dutkiewicz, W. Gasior, J. Salawa, Bull. Alloy Phase Diagrams 4, 330 (1985)

59.

K. Suganuma, K. Niihara, T. Shoutoku, Y. Nakamura, J. Mater. Res. 13, 2859 (1998)

60.

K.-L. Lin, T.-P. Liu, Oxid. Met. 50, 255 (1998)

61.

Y.C. Chan, M.Y. Chiu, T.H. Chuang, Z. Metallkd. 93, 95 (2002)

62.

I. Shohji, T. Nakamura, F. Mori, S. Fujiuchi, Mater. Trans. 43, 1797 (2002)

63.

J.-M. Song, K.-L. Lin, J. Mater. Res. 18, 2060 (2003)

64.

K.-S. Kim, J.-M. Yang, C.-H. Yu, I.-O. Jung, H.-H. Kim, J. Alloys Compd. 379, 314 (2004)

65.

M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, K. Sato, J. Mater. Res. 19, 2887 (2004)

66.

C.-W. Huang, K.-L. Lin, J. Mater. Res. 19, 3560 (2004)

67.

B.-J. Lee, CALPHAD 20, 471 (1996)

68.

H. Ohtani, M. Miyashita, K. Ishida, J. Jpn. Inst. Met. 63, 685 (1999)

69.

B.-J. Lee, N.M. Hwang, H.M. Lee, Acta Mater. 45, 1867 (1997)

70.

C.-Y. Chou, S.-W. Chen, Acta Mater. 54, 2393 (2006)

71.

C.-Y. Chou, S.-W. Chen, Y. S. Chang, J. Mater. Res. 21, 1849 (2006)

72.

M.Y. Chiu, S.S. Wang, T.H. Chuang, J. Electron. Mater. 31, 494 (2002)

73.

H. Okamoto, in Binary Alloy Phase Diagram, 2nd edn. (ASM, Metals Park, Ohio, 1990), p. 794

74.

B.-J. Lee, C.-S. Oh, J.-H. Shim, J. Electron. Mater. 25, 983 (1996)

75.

S. Hassam, E. Dichi, B. Legendre, J. Alloys Compd. 268, 199 (1998)

76.

H. Ohtani, I. Satoh, M. Miyashita, K. Ishida, Mater. Trans. 42, 722 (2001)

77.

A. Prince, G.V. Raynor, D.S. Evans, in Phase Diagrams of Ternary Gold Alloys (Institute of Metals, London, 1990) p. 168

78.

D. Kim, C.C. Lee, in Proceedings of the 53rd Electronic Components and Technology Conference, New Orleans, USA, May 2003, p. 668

79.

K. Doi, H. Ohtani, M. Hasebe, Mater. Trans. 45, 380 (2004)

80.

P.T. Vianco, A.C. Kilgo, R. Grant, J. Electron. Mater. 24, 1493 (1995)

81.

J.-W. Yoon, C.-B. Lee, S.-B. Jung, Mater. Trans. 43, 1821 (2002)

82.

J.-I. Lee, S.-W. Chen, H.-Y. Chang, C.-M. Chen, J. Electron. Mater. 32, 117 (2003)

83.

W.H. Tao, C. Chen, C.E. Ho, W.T. Chen, C.R. Kao, Chem. Mater. 13, 1051 (2001)

84.

D.V. Malakhov, X.J. Liu, I. Ohnuma, K. Ishida, J. Phase Equilib. 21, 514 (2000)

85.

H. Paul, Solder. Surf. Mount Technol. 11, 46 (1999)

86.

N. Moelans, K.C. Hari, P. Wollants, J. Alloys Compd. 360, 98 (2003)

87.

Z. Mei, J.W. Morris Jr., J. Electron. Mater. 21, 401 (1992)

88.

K. Shimizu, T. Nakanishi, K. Karasawa, K. Hashimoto, K. Niwa, J. Electron. Mater. 24, 39 (1995)

89.

N.C. Lee, Solder. Surf. Mount Technol. 9, 65 (1997)

90.

A.T. Kosilov, G.L. Polner, I.U. Smurov, V.V. Zenin, Sci. Technol. Weld. Joining 9, 169 (2004)

91.

H. Okamoto, in Phase Diagrams of Indium Alloys and Their Engineering Application, ed. by C.E.T. White, H. Okamoto (ASM international, Materials Park, OH, 1992), pp. 255–257

92.

T.M. Korhonen, J.K. Kivilahti, J. Electron. Mater. 27, 149 (1998)

93.

X.J. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, J. Pstrus, J. Electron. Mater. 31, 1139 (2002)

94.

G.P. Vassilev, E.S. Dobrev, J.-C. Tedenac, J. Alloys Compd. 399, 118 (2005)

95.

Y.M. Liu, T.H. Chuang, J. Electron. Mater. 29, 1328 (2000)

96.

M.D. Cheng, S.S. Wang, T.H. Chuang, J. Electron. Mater. 31, 171 (2002)

97.

A. Prince, G.V. Raynor, D.S. Evans, in Phase Diagrams of Ternary Gold Alloys, ed. by A. Prince, V. Raynor, D.S. Evans (The Institute of Metals, London, 1990), pp. 300–302

98.

H.S. Liu, C. Liu, K. Ishida, Z.P. Jin, J. Electron. Mater. 32, 1290 (2003)

99.

T.H. Chuang, S.Y. Chang, L.C. Tsao, W.P. Weng, H.M. Wu, J. Electron. Mater. 32, 195 (2003)

100.

P.G. Kim, K.N. Tu, Mater. Chem. Phys. 53, 165 (1998)

101.

W. Köster, T. Gödecke, D. Heine, Z. Metallkd. Bd. 63, H. 12 (1972) 802

102.

X.J. Liu, H.S. Liu, I. Ohnuma, R. Kainuma, K. Ishida, S. Itabashi, K. Kameda, K. Yamaguchi, J. Electron. Mater. 30, 1093 (2001)

103.

S.-K. Lin, T.-Y. Chung, S.-W. Chen, Y.-W. Yen, unpublished results, (2006)

104.

A.D. Romig Jr., F.G. Yost, P.F. Hlava, in Microbeam Analysis-1984 ed. by A.D. Romig Jr., J.I. Goldstein (San Francisco Press, 1984), p. 87

105.

P.T. Vianco, P.F. Hlava, A.C. Kilgo, J. Electron. Mater. 23, 583 (1994)

106.

T.H. Chuang, C.L. Yu, S.Y. Chang, S.S. Wang, J. Electron. Mater. 31, 640 (2002)

107.

S. Sommadossi, W. Gust, E.J. Mitteneijer, Mater. Chem. Phys. 77, 924 (2003)

108.

D.-G. Kim, S.-B. Jung, J. Alloys Compd. 386, 1515 (2005)

109.

W. Burkhardt, K. Schubert, Z. Metallkd 50, 442 (1959)

110.

M.K. Bhargava, K. Schubert, Z. Metallkd. 67, 318 (1976)

111.

S.K. Shadangi, M. Singh, S.C. Panda, S. Bhan, Indian J. Technol. 24, 105 (1986)

112.

C.-Y. Huang, S.-W. Chen, J. Electron. Mater. 31, 152 (2002)

113.

D.-G. Kim, S.-B. Jung, J. Electron. Mater. 33, 1561 (2004)

114.

T.H. Chuang, K.W. Huang, W.H. Lin, J. Electron. Mater. 33, 374 (2004)

115.

R.K. Mahidhara, S.M.L. Sastry, I. Turlik, K.K. Murty, Scripta Metall. Mater. 31, 1145 (1994)

116.

J.W. Jang, P.G. Kim, K.N. Tu, M. Lee, J. Mater. Res. 14, 3895 (1999)

117.

A.R. Geranmayeh, R. Mahmudi, J. Mater. Sci. 40, 3361 (2005)

118.

B. Predel, W. Schwermann, J. Inst. Met. 99, 169 (1971)

119.

B. Jonsson, J. Agren, Mater. Sci. Technol. 2, 913 (1986)

120.

C.-S. Oh, J.-H. Shim, B.-J. Lee, D.N. Lee, J. Alloys Compd. 238, 155 (1996)

121.

Z. Moser, W. Gasior, J. Pstrus, S. Ishihara, X.J. Liu, I. Ohnuma, R. Kainuma, K. Ishida, Mater. Trans. 45, 652 (2004)

122.

D.B. Masson, B.K. Kirkpatrick, J. Electro. Mater. 15, 349 (1986)

123.

J.H. Kim, S.W. Jeong, H.M. Lee, J. Electron. Mater. 31, 557 (2002)

124.

Y. Takaku, X.J. Liu, I. Ohnuma, R. Kainuma, K. Ishida, Mater. Trans. 45, 646 (2004)

125.

P. Villars, A. Prince, H. Okamoto, in Handbook of Ternary Alloy Phase Diagram (ASM, Metals Park, Ohio, 1995), p. 13010

Title: Phase Diagrams of Pb-Free Solders and their Related Materials Systems
Authors: Sinn-Wen Chen
Chao-Hong Wang
Shih-Kang Lin
Chen-Nan Chiu
Publication date: 01-03-2007
Publisher: Kluwer Academic Publishers-Plenum Publishers
Published in: Journal of Materials Science: Materials in Electronics / Issue 1-3/2007
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-006-9010-x

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Springer Professional "Wirtschaft"

Other articles of this Issue 1-3/2007

Processing and material issues related to lead-free soldering

Tin pest issues in lead-free electronic solders

Sn-whiskers: truths and myths

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Mechanical fatigue of Sn-rich Pb-free solder alloys

Electromigration issues in lead-free solder joints