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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 1-3/2007

01-03-2007

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

Authors: N. Chawla, R. S. Sidhu

Published in: Journal of Materials Science: Materials in Electronics | Issue 1-3/2007

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Abstract

The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide several examples where 2D and 3D microstructures have been used to model the material behavior using finite element modeling. These included (a) 3D visualization of the solder microstructure, (b) 3D microstructure-based modeling of tensile behavior, (c) 2D modeling of the effect of intermetallic volume fraction and morphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.
previous article Interfacial reaction issues for lead-free electronic solders
next article Deformation behavior of tin and some tin alloys

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Literature
1.
S. Kang, A.K. Sarkhel, J. Electron. Mater. 23, 701 (1994)
2.
D.R. Frear, P.T. Vianco, Metall. Mater. Trans. A 25, 1509 (1994)
3.
J. Glazer, Inter. Mater. Rev. 40, 65 (1995)
4.
W.J. Plumbridge, C.R. Gagg, Proc. Inst. Mech. Engrs. L, J. Mater.: Des Appl. 214, 153 (2000)
5.
6.
F. Ochoa, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1414 (2003)
7.
F. Ochoa, J.J. Williams, N. Chawla, JOM 55, 56 (2003)
8.
9.
10.
11.
N. Chawla, F. Ochoa, S. Scaritt, M. Koopman, K.K. Chawla, V.V. Ganesh, X. Deng, J. Mater. Sci.: Mater. Electron. 15, 385 (2004)CrossRef
12.
13.
W.M. Sherry, J.S. Erich, M.K. Bartschat, F.B. Prinz, IEEE Trans. Comp., Hybrids Manuf. Tech. 8, 417 (1985)CrossRef
14.
D.G. Kim, H.S. Jang, J.W. Kim, S.B. Jung, J. Mater. Sci.: Mater. Elec. 16, 603 (2005)CrossRef
15.
S. Ling, A. Dasgupta, Trans. ASME 118, 72 (1996)
16.
17.
18.
19.
20.
C.J. Zhai, Sidharth, R. Blish II, IEEE Trans. Device Mater. Rel. 3, 207 (2003)
21.
M.P. Rodriquez, N.Y.A. Shammas, A.T. Plumpton, D. Newcombe, D.E. Crees, Microelec. Rel. 40, 455 (2000)CrossRef
22.
23.
24.
C.G. Schmidt, J.W. Simons, C.H. Kanazawa, D.C. Elrich, IEEE Trans. Comp., Pack., Manuf. Tech. A 18, 611 (1995)CrossRef
25.
26.
27.
B.Z. Hong, L.G. Burrell, IEEE Trans. Comp., Pack., Manuf. Tech. A 18, 585 (1995)CrossRef
28.
29.
E.E. Underwood, in Quantitative Microscopy, ed. by R.T Dehoof, F.N. Rhines (McGraw-Hill, New York, 1968), p. 149
30.
B. Wunsch, X. Deng, N. Chawla, in Computational Methods in Materials Characterisation, ed. by A.A. Mammoli, C.A. Brebbia (WIT Press, Boston, 2004), pp. 175–184
31.
32.
M. Li, S. Ghosh, T.N. Rouns, H. Weiland, O. Richmond, W. Hunt, Mater. Charact. 41, 81 (1998)CrossRef
33.
M. Li, S. Ghosh, O. Richmond, H. Weiland, T.N. Rouns, Mater. Sci. Eng. A 265, 153 (1999)CrossRef
34.
M.V. Kral, M.A. Mangan, G. Spanos, R.O. Rosenberg, Mater. Charact. 45, 17 (2000)CrossRef
35.
T. Yokomizo, M. Enomoto, O. Umezawa, G. Spanos, R.O. Rosenberg, Mater. Sci. Eng. A 344, 261 (2003)CrossRef
36.
C.Y. Hung, G. Spanos, R.O. Rosenberg, M.V. Kral, Acta Mater. 50, 3781 (2002)CrossRef
37.
A.C. Lund, P.W. Voorhees, Acta Mater. 50, 2582 (2002)
38.
39.
M. Yamaguchi, S.K. Biswas, Y. Suzuki, H. Furukawa, K. Takeo, FEMS Microbio. Lett. 219, 17 (2003)CrossRef
40.
41.
42.
43.
44.
45.
46.
47.
W. Yang, L.E. Felton, R.W. Messler, J. Electron. Mater. 24, 1465 (1995)
48.
49.
X. Deng, G. Piotrowski, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1403 (2003)
50.
51.
W.K. Choi, H.M. Lee, J. Electron. Mater. 29, 1207 (2000)
52.
F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian, J. Electron. Mater. 29, 1241 (2000)
53.
54.
55.
S. Chada, R.A. Fournelle, W. Laub, D. Shangguan, J. Electron. Mater. 29, 1214 (2000)
56.
Z. Mei, A.J. Sunwoo, J.W. Morris Jr, Metall. Trans. A 23, 857 (1992)
57.
W.K. Choi, H.M. Lee, J. Electron. Mater 29, 1207 (2000)
58.
59.
60.
H.L.J. Pang, K.H. Tan, X.W. Shi, Z.P. Wang, Mater. Sci. Eng. A 307, 42 (2001)CrossRef
61.
62.
P. Protsenko, A. Terlain, V. Traskine, N. Eustathopoulos, Scripta Mater. 45, 1439 (2001)CrossRef
63.
64.
R.E. Pratt, E.I. Stromswold, D.J. Quesnel, J. Electron. Mater. 23, 375 (1994)
65.
C.K. Alex, Y.C. Chan, IEEE Trans. CPMT-B 19, 661 (1996)
66.
P.L. Tu, Y.C. Chan, J.K.L. Lai, IEEE Trans. CPMT-B 20, 87 (1997)
67.
X. Deng, R.S. Sidhu, P. Johnson, N. Chawla, Metall. Mater. Trans A 36, 55 (2005)
68.
X. Deng, M. Koopman, N. Chawla, K.K. Chawla, Mater. Sci. Eng. 364, 241 (2004)
69.
70.
71.
72.
F. Erdogan, G.C. Sih, J. Basic Eng. (1963) 519
73.
Metadata
Title
Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
Authors
N. Chawla
R. S. Sidhu
Publication date
01-03-2007
Published in
Journal of Materials Science: Materials in Electronics / Issue 1-3/2007
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-9028-0

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