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Published in: Journal of Materials Engineering and Performance 1/2019

06-12-2018

Ultra-Shallow Doping B, Mg, Ni, Cu, Mn, Cr and Fe into SiC with Very High Surface Concentrations Based on Plasma Stimulated Room-Temperature Diffusion

Authors: Ruixiang Hou, Lei Li, Xin Fang, Hui Zhao, Yihang Chen, Ziang Xie, Guosheng Sun, Xinhe Zhang, Yanfei Zhao, Rong Huang, Zengli Huang, Youqin He, Nongnong Ma, Jicai Zhang, Wanjing Xu, Jinbo Yang, Chijie Xiao, G. G. Qin

Published in: Journal of Materials Engineering and Performance | Issue 1/2019

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Abstract

Very recently, we reported a novel doping method called plasma doping without any external bias (PDWOEB) for the introduction of some impurities into Si and GaN at room temperature (RT). In this work, the RT doping of some impurities, including B, Mg, Ni, Cu, Mn, Cr and Fe, into SiC with ultra-shallow depths of tens of nanometer and very high surface concentrations, approaching or exceeding 1E20/cm3, by using PDWOEB is reported. It has been found for the first time that the doping depths and surface concentrations of these impurities doped into SiC by the PDWOEB increase drastically with increasing doping time and the ferromagnetism of SiC due to Ni doping is demonstrated. Moreover, the approximate diffusivities of B, Mg, Ni, Cu, Mn, Cr and Fe in SiC at RT under plasma stimulation are obtained. The physical mechanism of PDWOEB is further discussed, and some unclear viewpoints are clarified.

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Literature
1.
go back to reference E.M. Handy, M.V. Rao, O.W. Holland, P.H. Chi, K.A. Jones, M.A. Derenge, R.D. Vispute, and T. Venkatesan, Al B and Ga Ion-Implantation Doping of SiC, J. Electron. Mater., 2000, 29, p 1340–1345CrossRef E.M. Handy, M.V. Rao, O.W. Holland, P.H. Chi, K.A. Jones, M.A. Derenge, R.D. Vispute, and T. Venkatesan, Al B and Ga Ion-Implantation Doping of SiC, J. Electron. Mater., 2000, 29, p 1340–1345CrossRef
2.
go back to reference C.L. Zhu, Rusli, and P. Zhao, Dual-Channel 4H-SiC Metal Semiconductor Field Effect Transistors, Solid-State Electron., 2007, 51, p 343–346CrossRef C.L. Zhu, Rusli, and P. Zhao, Dual-Channel 4H-SiC Metal Semiconductor Field Effect Transistors, Solid-State Electron., 2007, 51, p 343–346CrossRef
3.
go back to reference B.J. Baliga, Prospects for Development of SiC Power Devices, Inst. Phys. Conf. Ser., 1996, 142, p 1 B.J. Baliga, Prospects for Development of SiC Power Devices, Inst. Phys. Conf. Ser., 1996, 142, p 1
4.
go back to reference L.V. Rozario, L.P. Sadwick, R.J. Hwu, and D.B. King, SiC BGJFET Inverter for High Temperature/Power Applications, in Proc. of Fourth Int. High Temp. Electron. Conf. (HiTec) (1998), p 29 L.V. Rozario, L.P. Sadwick, R.J. Hwu, and D.B. King, SiC BGJFET Inverter for High Temperature/Power Applications, in Proc. of Fourth Int. High Temp. Electron. Conf. (HiTec) (1998), p 29
5.
go back to reference C.E. Weitzel, Silicon Carbide High Frequency Devices, Mater. Sci. Forum, 1998, 264-268, p 907–912CrossRef C.E. Weitzel, Silicon Carbide High Frequency Devices, Mater. Sci. Forum, 1998, 264-268, p 907–912CrossRef
6.
go back to reference H. Matsunami, Current SiC Technology for Power Electronic Devices Beyond Si, Microelectron. Eng., 2006, 83, p 2–4CrossRef H. Matsunami, Current SiC Technology for Power Electronic Devices Beyond Si, Microelectron. Eng., 2006, 83, p 2–4CrossRef
7.
go back to reference S. Sriram et al., High-Performance Implanted-Channel SiC MESFETS, IEEE Electron Device Lett., 2011, 32(3), p 243–245CrossRef S. Sriram et al., High-Performance Implanted-Channel SiC MESFETS, IEEE Electron Device Lett., 2011, 32(3), p 243–245CrossRef
8.
go back to reference T. Troffer, M. Schadt, T. Frank, H. Itoh, G. Pensl, J. Heindl, H.P. Strunk, and M. Maier, Doping of SiC by Implantation of Boron and Aluminum, Phys. Status Solidi A, 1997, 162, p 277–298CrossRef T. Troffer, M. Schadt, T. Frank, H. Itoh, G. Pensl, J. Heindl, H.P. Strunk, and M. Maier, Doping of SiC by Implantation of Boron and Aluminum, Phys. Status Solidi A, 1997, 162, p 277–298CrossRef
9.
go back to reference T. Kimoto, O. Takemura, H. Matsunami, T. Nakata, and M. Inoue, Al+ and B+ Implantations into 6H-SiC Epilayers and Application to PN Junction Diodes, J. Electron. Mater., 1998, 27, p 358–364CrossRef T. Kimoto, O. Takemura, H. Matsunami, T. Nakata, and M. Inoue, Al+ and B+ Implantations into 6H-SiC Epilayers and Application to PN Junction Diodes, J. Electron. Mater., 1998, 27, p 358–364CrossRef
10.
go back to reference R. Hou, Z. Xie, L. Li, X. Xie, X. Xu, X. Fang, L. Tao, W. Xu, N. Ma, Y. He, X. Chen, S. Peng, E. Fu, Z. Yuan, and G. Qin, Room-Temperature Plasma Doping Without Bias Power for Introduction of Fe, Au, Al, Ga, Sn and In into Si, Appl. Phys. A, 2016, 122, p. 1013. R. Hou, Z. Xie, L. Li, X. Xie, X. Xu, X. Fang, L. Tao, W. Xu, N. Ma, Y. He, X. Chen, S. Peng, E. Fu, Z. Yuan, and G. Qin, Room-Temperature Plasma Doping Without Bias Power for Introduction of Fe, Au, Al, Ga, Sn and In into Si, Appl. Phys. A, 2016, 122, p. 1013.
11.
go back to reference R. Hou, X. Fang, L. Li, S. Li, W. Song, X. Xie, Z. Xie, W. Xu, S. Pan, D. Li, C. Xiao, and G. G. Qin, Doping Si, Mg and Ca into GaN Based on Plasma Stimulated Room-Temperature Diffusion, Appl. Phys. A, 2017, 123, p. 393. R. Hou, X. Fang, L. Li, S. Li, W. Song, X. Xie, Z. Xie, W. Xu, S. Pan, D. Li, C. Xiao, and G. G. Qin, Doping Si, Mg and Ca into GaN Based on Plasma Stimulated Room-Temperature Diffusion, Appl. Phys. A, 2017, 123, p. 393.
12.
go back to reference J.R. Conrad, J.L. Radtke, R.A. Dodd, F.J. Worzala, and N.C. Tran, Plasma Source Ion-Implantation Technique for Surface Modification of Materials, J. Appl. Phys., 1987, 62, p 4591–4596CrossRef J.R. Conrad, J.L. Radtke, R.A. Dodd, F.J. Worzala, and N.C. Tran, Plasma Source Ion-Implantation Technique for Surface Modification of Materials, J. Appl. Phys., 1987, 62, p 4591–4596CrossRef
13.
go back to reference A. Anders, From Plasma Immersion Ion Implantation to Deposition: A Historical Perspective on Principles and Trends, Surf. Coat. Technol., 2002, 156, p 3–12CrossRef A. Anders, From Plasma Immersion Ion Implantation to Deposition: A Historical Perspective on Principles and Trends, Surf. Coat. Technol., 2002, 156, p 3–12CrossRef
14.
go back to reference A. Anders, Metal Plasma Immersion Ion Implantation and Deposition: A Review, Surf. Coat. Technol., 1997, 93, p 158–167CrossRef A. Anders, Metal Plasma Immersion Ion Implantation and Deposition: A Review, Surf. Coat. Technol., 1997, 93, p 158–167CrossRef
15.
go back to reference J. Pelletier and A. Anders, Plasma-Based Ion Implantation and Deposition: A Review of Physics, Technology, and Applications, IEEE Trans. Plasma Sci., 2005, 33(6), p 1944–1959CrossRef J. Pelletier and A. Anders, Plasma-Based Ion Implantation and Deposition: A Review of Physics, Technology, and Applications, IEEE Trans. Plasma Sci., 2005, 33(6), p 1944–1959CrossRef
16.
go back to reference P.K. Chu, Contamination Issues in Hydrogen Plasma Immersion Ion Implantation Of Silicon—A Brief Review, Surf. Coat. Technol., 2002, 156, p 244–252CrossRef P.K. Chu, Contamination Issues in Hydrogen Plasma Immersion Ion Implantation Of Silicon—A Brief Review, Surf. Coat. Technol., 2002, 156, p 244–252CrossRef
17.
go back to reference F. Yuting, X. Jin, N. Sun, C. Li, Y. An, and J. Liu, Effects of Ni Doping and Structural Defects on Magnetic Properties of Annealed SiC Films, Superlattices Microstruct., 2016, 96, p 267–272CrossRef F. Yuting, X. Jin, N. Sun, C. Li, Y. An, and J. Liu, Effects of Ni Doping and Structural Defects on Magnetic Properties of Annealed SiC Films, Superlattices Microstruct., 2016, 96, p 267–272CrossRef
18.
go back to reference Y. Dou, H. Jin, M. Cao, X. Fang, Z. Hou, and S. Dan Li, Agathopoulos, Structural Stability, Electronic and Optical Properties of Ni-Doped 3C–SiC by First Principles Calculation, J. Alloy. Compd., 2011, 509, p 6117–6122CrossRef Y. Dou, H. Jin, M. Cao, X. Fang, Z. Hou, and S. Dan Li, Agathopoulos, Structural Stability, Electronic and Optical Properties of Ni-Doped 3C–SiC by First Principles Calculation, J. Alloy. Compd., 2011, 509, p 6117–6122CrossRef
19.
go back to reference J. Crofton, P.G. McMullin, J.R. Williams, and M.J. Bozack, High-Temperature Ohmic Contact to n-type 6H-SiC Using Nickel, J. Appl. Phys., 1995, 77, p 1317–1319CrossRef J. Crofton, P.G. McMullin, J.R. Williams, and M.J. Bozack, High-Temperature Ohmic Contact to n-type 6H-SiC Using Nickel, J. Appl. Phys., 1995, 77, p 1317–1319CrossRef
20.
go back to reference G. Oskam, P.C. Searson, and M.W. Cole, Fabrication of n-type 4H–SiC/Ni Junctions Using Electrochemical Deposition, Appl. Phys. Lett., 2000, 76, p 1300–1302CrossRef G. Oskam, P.C. Searson, and M.W. Cole, Fabrication of n-type 4H–SiC/Ni Junctions Using Electrochemical Deposition, Appl. Phys. Lett., 2000, 76, p 1300–1302CrossRef
21.
go back to reference G.R. Fisher and P. Barnes, Towards a Unified View of Polytypism in Silicon Carbide, Phil. Mag. B, 1990, 61, p 217–236CrossRef G.R. Fisher and P. Barnes, Towards a Unified View of Polytypism in Silicon Carbide, Phil. Mag. B, 1990, 61, p 217–236CrossRef
22.
go back to reference A. Lohrmann, B.C. Johnson, J.C. McCallum, and S. Castelletto, A Review on Single Photon Sources in Silicon Carbide, Rep. Prog. Phys. 2017, 80, p. 034502. A. Lohrmann, B.C. Johnson, J.C. McCallum, and S. Castelletto, A Review on Single Photon Sources in Silicon Carbide, Rep. Prog. Phys. 2017, 80, p. 034502.
23.
go back to reference S. Oswald and H. Wirth, Core-Level Shifts at B- and Al-Doped 6H-SiC Studied by XPS, Surf. Interface Anal., 1999, 27, p 136–141CrossRef S. Oswald and H. Wirth, Core-Level Shifts at B- and Al-Doped 6H-SiC Studied by XPS, Surf. Interface Anal., 1999, 27, p 136–141CrossRef
24.
go back to reference E. Stamate, Status and Challenges in Electrical Diagnostics of Processing Plasmas, Surf. Coat. Technol., 2014, 260, p 401–410CrossRef E. Stamate, Status and Challenges in Electrical Diagnostics of Processing Plasmas, Surf. Coat. Technol., 2014, 260, p 401–410CrossRef
25.
go back to reference S. Soloviev, Y. Gao, X. Wang, and T. Sudarshan, Boron Diffusion into 6H-SiC Through Graphite Mask, J. Electron. Mater., 2001, 30(3), p 224–227CrossRef S. Soloviev, Y. Gao, X. Wang, and T. Sudarshan, Boron Diffusion into 6H-SiC Through Graphite Mask, J. Electron. Mater., 2001, 30(3), p 224–227CrossRef
26.
go back to reference R. Hou, L. Li, X. Fang, Z. Xie, S. Li, W. Song, R. Huang, J. Zhang, Z. Huang, Q. Li, W. Xu, E. Fu, and G.G. Qin, Ambient-Temperature Diffusion and Gettering of Pt Atoms in GaN with Surface Defect Region Under 60Co Gamma or MeV Electron Irradiation, Nucl. Instrum. Methods Phys. Res. Sect. B, 2018, 414, p 74–78. R. Hou, L. Li, X. Fang, Z. Xie, S. Li, W. Song, R. Huang, J. Zhang, Z. Huang, Q. Li, W. Xu, E. Fu, and G.G. Qin, Ambient-Temperature Diffusion and Gettering of Pt Atoms in GaN with Surface Defect Region Under 60Co Gamma or MeV Electron Irradiation, Nucl. Instrum. Methods Phys. Res. Sect. B, 2018, 414, p 74–78.
27.
go back to reference J.D. Weeks, J.C. Tully, and L.C. Kimerling, Theory of Recombination-Enhanced Defect Reactions in Semiconductors, Phys. Rev. B, 1975, 12, p 3286–3292CrossRef J.D. Weeks, J.C. Tully, and L.C. Kimerling, Theory of Recombination-Enhanced Defect Reactions in Semiconductors, Phys. Rev. B, 1975, 12, p 3286–3292CrossRef
28.
go back to reference T. Wada and K. Yasuda, Mechanism of Electron-Beam Doping in Semiconductors, Phys. Rev. B, 1996, 53, p 4770–4781CrossRef T. Wada and K. Yasuda, Mechanism of Electron-Beam Doping in Semiconductors, Phys. Rev. B, 1996, 53, p 4770–4781CrossRef
29.
go back to reference R.B. Bird, W.E. Stewart, and E.N. Lightfoot, Transport Phenomena, Wiley, New York, 1976 R.B. Bird, W.E. Stewart, and E.N. Lightfoot, Transport Phenomena, Wiley, New York, 1976
Metadata
Title
Ultra-Shallow Doping B, Mg, Ni, Cu, Mn, Cr and Fe into SiC with Very High Surface Concentrations Based on Plasma Stimulated Room-Temperature Diffusion
Authors
Ruixiang Hou
Lei Li
Xin Fang
Hui Zhao
Yihang Chen
Ziang Xie
Guosheng Sun
Xinhe Zhang
Yanfei Zhao
Rong Huang
Zengli Huang
Youqin He
Nongnong Ma
Jicai Zhang
Wanjing Xu
Jinbo Yang
Chijie Xiao
G. G. Qin
Publication date
06-12-2018
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 1/2019
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-018-3782-z

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