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Published in: Microsystem Technologies 1/2013

01-01-2013 | Technical Paper

Design and fabrication of a silicon probe for surface profilers

Authors: Senlin Jiang, Dacheng Zhang, Longtao Lin, Zhenchuan Yang, Qiancheng Zhao, Guizhen Yan

Published in: Microsystem Technologies | Issue 1/2013

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Abstract

A micromachining probe for surface profilers is reported in this paper. This probe employs single crystal silicon double-ended tuning forks (DETFs) as the sensitive unit to achieve high resolution and frequency read-out. The frequency shift of the DETFs caused by the induced axial stress is directly proportional to the undulation of the measured surface. Moreover, one-stage and two-stage microleverage amplification mechanisms are respectively implemented to improve the probe performance. The silicon on glass (SOG) process which can provide high aspect ratio single crystal silicon structures has been adopted to enhance the performance of the probes. The testing results indicate that the probe with two-stage mechanical amplifiers has a frequency-displacement sensitivity of 257.1 Hz/μm with a nominal frequency 27.3 kHz at room temperature in atmosphere, which is in close agreement with the simulation results.

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Literature
go back to reference Bosseboeuf A, Petitgrand S (2003) Characterization of the static and dynamic behavior of M(O)EMS by optical techniques: status and trends. J Micromech Microeng 13(4):S23–S33CrossRef Bosseboeuf A, Petitgrand S (2003) Characterization of the static and dynamic behavior of M(O)EMS by optical techniques: status and trends. J Micromech Microeng 13(4):S23–S33CrossRef
go back to reference Bustillo JM, Howe RT, Muller RS (1998) Surface micromachining for microelectromechanical systems. Proc IEEE 86(8):1552–1574CrossRef Bustillo JM, Howe RT, Muller RS (1998) Surface micromachining for microelectromechanical systems. Proc IEEE 86(8):1552–1574CrossRef
go back to reference Denhoff MW (2003) A measurement of young’s modulus and residual stress in MEMS bridges using a surface profiler. J Micromech Microeng 13(5):686–692CrossRef Denhoff MW (2003) A measurement of young’s modulus and residual stress in MEMS bridges using a surface profiler. J Micromech Microeng 13(5):686–692CrossRef
go back to reference Garbini JL, Koh S, Jorgensen JE, Ramulu M (1992) Surface profile measurement during turning using Fringe-Field capacitive profilometry. J Dyn Syst Meas Control 114(2):234–243MATHCrossRef Garbini JL, Koh S, Jorgensen JE, Ramulu M (1992) Surface profile measurement during turning using Fringe-Field capacitive profilometry. J Dyn Syst Meas Control 114(2):234–243MATHCrossRef
go back to reference Haque MA, Saif MTA (2003) A review of MEMS-based microscale and nanoscale tensile and bending testing. Exp Mech 43(3):248–255CrossRef Haque MA, Saif MTA (2003) A review of MEMS-based microscale and nanoscale tensile and bending testing. Exp Mech 43(3):248–255CrossRef
go back to reference Jiang S, Zhang D, Lin L, Yang Z, Yan G (2011) Silicon probe for micromachined surface profilers. IET Micro Nano Lett 6(7):490–493CrossRef Jiang S, Zhang D, Lin L, Yang Z, Yan G (2011) Silicon probe for micromachined surface profilers. IET Micro Nano Lett 6(7):490–493CrossRef
go back to reference Kenny T (2001) Nanometer-scale force sensing with MEMS devices. IEEE Sens J 1(2):148–157CrossRef Kenny T (2001) Nanometer-scale force sensing with MEMS devices. IEEE Sens J 1(2):148–157CrossRef
go back to reference Lee JE, Bahreyni B, Seshia AA (2008) An axial strain modulated double-ended tuning fork electrometer. Sens Actuators A Phys 148(2):395–400CrossRef Lee JE, Bahreyni B, Seshia AA (2008) An axial strain modulated double-ended tuning fork electrometer. Sens Actuators A Phys 148(2):395–400CrossRef
go back to reference Liu C, Huang J, Zhu Z, Jiang F, Tung S, Tai Y, Ho C (1999) A micromachined flow shear-stress sensor based on thermal transfer principles. J Microelectromech Syst 8(1):90–99CrossRef Liu C, Huang J, Zhu Z, Jiang F, Tung S, Tai Y, Ho C (1999) A micromachined flow shear-stress sensor based on thermal transfer principles. J Microelectromech Syst 8(1):90–99CrossRef
go back to reference Mackay RE, Lionis N, Le HR (2011) 3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS. Microsyst Technol 17(12):1763–1770CrossRef Mackay RE, Lionis N, Le HR (2011) 3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS. Microsyst Technol 17(12):1763–1770CrossRef
go back to reference Peiner E, Doering L (2005) Force calibration of stylus instruments using silicon microcantilevers. Sens Actuators A Phys 123–124:137–145CrossRef Peiner E, Doering L (2005) Force calibration of stylus instruments using silicon microcantilevers. Sens Actuators A Phys 123–124:137–145CrossRef
go back to reference Pruitt BL, Park W, Kenny TW (2004) Measurement system for low force and small displacement contacts. J Microelectromech Syst 13(2):220–229CrossRef Pruitt BL, Park W, Kenny TW (2004) Measurement system for low force and small displacement contacts. J Microelectromech Syst 13(2):220–229CrossRef
go back to reference Shin D, Kim B (2011) A laser interferometer encoder with two micromachined gratings generating phase-shifted quadrature. J Micromech Microeng 21(8):085036CrossRef Shin D, Kim B (2011) A laser interferometer encoder with two micromachined gratings generating phase-shifted quadrature. J Micromech Microeng 21(8):085036CrossRef
go back to reference Su SX, Yang HS, Agogino AM (2005) A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology. IEEE Sens J 5(6):1214–1223CrossRef Su SX, Yang HS, Agogino AM (2005) A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology. IEEE Sens J 5(6):1214–1223CrossRef
go back to reference Wang T, Zheng S, Yang Z (1998) A high precision displacement sensor using a low-finesse fiber-optic Fabry-Prot interferometer. Sens Actuators A Phys 69(2):134–138CrossRef Wang T, Zheng S, Yang Z (1998) A high precision displacement sensor using a low-finesse fiber-optic Fabry-Prot interferometer. Sens Actuators A Phys 69(2):134–138CrossRef
Metadata
Title
Design and fabrication of a silicon probe for surface profilers
Authors
Senlin Jiang
Dacheng Zhang
Longtao Lin
Zhenchuan Yang
Qiancheng Zhao
Guizhen Yan
Publication date
01-01-2013
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 1/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1586-x

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