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Published in: Microsystem Technologies 3-4/2007

01-02-2007 | Technical paper

Development of precision transfer technology of atmospheric hot embossing by ultrasonic vibration

Authors: Harutaka Mekaru, Osamu Nakamura, Osamu Maruyama, Ryutaro Maeda, Tadashi Hattori

Published in: Microsystem Technologies | Issue 3-4/2007

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Abstract

We succeeded to transfer a precise micro-pattern combining with an ultrasonic vibration in an atmospheric hot embossing on the almost same condition as a vacuum hot embossing. This paper reports the effect of the ultrasonic vibration that was verified experimentally. In the conventional method, a metallic mold and a plastic sheet are heated more than the glass transition temperature of the plastic, and the softened plastic is flowed into the pattern only by applying a load. On the other hand, a longitudinal ultrasonic vibration is added in the molding process of an ultrasonic-vibration hot embossing. The synergy effect of the load and the ultrasonic vibration enables flowing of the plastic into a more precise pattern of the metallic mold. The longitudinal wave generated by an ultrasonic vibration system of the frequency 15 kHz and output 900 W. A pattern of the Ni mold used in the experiment was a pyramid hole in which a peak was cut and sidewalls were rounded. Entrance lengths of pyramids were from 100 to 530 μm and its all of the depth were 260 μm. A polycarbonate was chosen with a replication material. Compared with the condition that the ultrasonic vibration was not used, a contact force and a contact time could be reduced to about 1/3 and 1/12, respectively.

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Literature
go back to reference Becker EW, Ehrfeld W, Hagmann P, Maner A, Münchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron Eng 4:35–42CrossRef Becker EW, Ehrfeld W, Hagmann P, Maner A, Münchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron Eng 4:35–42CrossRef
go back to reference Chou SY, Krauss PR, Renstrom PJ (1995) Imprint of sub−25 nm vias and trenches in polymers. Appl Phys Lett 67:3114CrossRef Chou SY, Krauss PR, Renstrom PJ (1995) Imprint of sub−25 nm vias and trenches in polymers. Appl Phys Lett 67:3114CrossRef
go back to reference Heckele M, Bacher W, Müller KD (1998) Hot embossing—the molding technique for plastic microstructures. Microsystem Technol 4:122–124CrossRef Heckele M, Bacher W, Müller KD (1998) Hot embossing—the molding technique for plastic microstructures. Microsystem Technol 4:122–124CrossRef
go back to reference Heckele M, Dittrich H, Guber A, Schaller T (2001) Double-side hot embossing of microstructures. HARMST’01, Book of abstract pp 137–138 Heckele M, Dittrich H, Guber A, Schaller T (2001) Double-side hot embossing of microstructures. HARMST’01, Book of abstract pp 137–138
go back to reference Mekaru H, Yamada T, Yan S, Hattori T (2004) Microfabrication by hot embossing and injection molding at LASTI. Microsystem Technol 10:682–688CrossRef Mekaru H, Yamada T, Yan S, Hattori T (2004) Microfabrication by hot embossing and injection molding at LASTI. Microsystem Technol 10:682–688CrossRef
go back to reference Roos N, Wissen M, Scheer H, Glinsner T (2003) Impact of vacuum environment on the hot embossing process. SPIE’s microlithography pp 22–28 Roos N, Wissen M, Scheer H, Glinsner T (2003) Impact of vacuum environment on the hot embossing process. SPIE’s microlithography pp 22–28
go back to reference Yamada T, Mekaru H, Ishigaki H, Hattori T, Kitazima A, Maeda R (2002) Microfabrication of polymer microstructure using hot embossing. In: Proceedings of JSME/ASME international conference on materials and processing 2002 2:597–600 Yamada T, Mekaru H, Ishigaki H, Hattori T, Kitazima A, Maeda R (2002) Microfabrication of polymer microstructure using hot embossing. In: Proceedings of JSME/ASME international conference on materials and processing 2002 2:597–600
Metadata
Title
Development of precision transfer technology of atmospheric hot embossing by ultrasonic vibration
Authors
Harutaka Mekaru
Osamu Nakamura
Osamu Maruyama
Ryutaro Maeda
Tadashi Hattori
Publication date
01-02-2007
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 3-4/2007
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0203-2

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