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Journal of Materials Engineering and Performance

Published in:

29-10-2020

Dynamic Recovery and Recrystallization Behaviors of C71500 Copper-Nickel Alloy Under Hot Deformation

Authors: Xin Gao, Hui-bin Wu, Ming Liu, Yuan-xiang Zhang, Xiang-dong Zhou

Published in: Journal of Materials Engineering and Performance | Issue 11/2020

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Abstract

The isothermal compression test was employed to study the influence of deformation temperature and strain rate on the hot deformation behavior of C71500 copper-nickel alloy. According to the characteristics of dynamic recovery (DRV) and dynamic recrystallization (DRX), the Zener–Hollomon parameter lnZ is used as an important parameter to measure the influence of temperature and strain rate on the hot deformation behavior. The critical deformation conditions of DRX are determined by its different values. By analyzing the critical change of work hardening rate, the relationship among critical stress, peak stress and saturation stress transition point is obtained, and the dynamic mathematical model of the whole deformation process is established, which can predict the volume fraction of DRV and DRX well. The DRX nucleation and growth mechanism of C71500 copper-nickel alloy was determined by metallographic analysis. In the current work, the thermodynamic parameters are introduced to determine the critical conditions of the transformation of the deformation state, the transformation process of the hot deformation structure is predicted by the dynamic model, the nucleation and growth mechanism is analyzed, which could provide a complete set of important references for the DRV-based hot deformation alloy, and provide a theoretical basis for the control of the structure state after hot processing.

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Title: Dynamic Recovery and Recrystallization Behaviors of C71500 Copper-Nickel Alloy Under Hot Deformation
Authors: Xin Gao
Hui-bin Wu
Ming Liu
Yuan-xiang Zhang
Xiang-dong Zhou
Publication date: 29-10-2020
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 11/2020
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-020-05221-x

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