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Published in: Journal of Materials Science: Materials in Electronics 9/2021

08-04-2021

Ultrahigh polar phase content PVDF-based composite films with ultralow filler loading for high-energy-density flexible capacitors

Authors: Shengliao Yan, Zhuo Chen, Yang Zhang, Yuping Yang, Yufeng Xiong, Lijie Dong

Published in: Journal of Materials Science: Materials in Electronics | Issue 9/2021

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Abstract

Flexible polymer dielectric capacitors are essential in the modern electrical field and have received extensive attention due to their ultrahigh power density. Polyvinylidene fluoride (PVDF) has a high dielectric permittivity and is considered one of the most promising dielectric materials. However, its low breakdown strength (< 350 MV/m) and low discharge efficiency (< 50 %) severely limit its practical applications. In this study, a new type of flexible polymer dielectric film was prepared by hot pressing and melting blending of ultralow content of modified sulfonated aromatic polyamide (f-PPTA) and PVDF. f-PPTA is obtained by ionic interaction between sulfonated aramid backbone and octadecyl polyoxyethylene ether (PEGO). The two amphiphilic segments in PEGO can reduce the melt viscosity of the composite system, which is beneficial to preparing composite films by melting. In addition, a large number of hydrogen bonds are formed between the hydroxyl groups in the PEGO segment and PVDF, which induces the formation of 98 % ultrahigh content polar phase. Consequently, when the electric field strength is 528 MV/m, the composite film obtains a high energy-storage density of 17 J/cm3 and maintains a charge and discharge efficiency of 65%. This method develops a new way to obtain PVDF-based composite films with ultrahigh polar phase content and is expected to develop in the direction of continuous melt film formation.

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Appendix
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Metadata
Title
Ultrahigh polar phase content PVDF-based composite films with ultralow filler loading for high-energy-density flexible capacitors
Authors
Shengliao Yan
Zhuo Chen
Yang Zhang
Yuping Yang
Yufeng Xiong
Lijie Dong
Publication date
08-04-2021
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 9/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-021-05837-2

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