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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1/2020

21.11.2019

Suppressed dielectric loss and enhanced thermal conductivity in poly(vinylidene fluoride) nanocomposites using polyethylene glycol-grafted graphene oxide

verfasst von: Wenqi Wu, Junyang Tu, Hairong Li, Ziwei Zhan, Leping Huang, Ziqing Cai, Qiong Li, Ming Jiang, Jing Huang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2020

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Abstract

In order to realize efficient electronic energy storage and transfer, low dielectric loss as well as high thermal conductivity can be highly desirable for dielectric materials due to the associated ability to reduce and release the electrical energy dissipation as heat. However, it is challenging for percolative dielectric composites to simultaneously realize the two objectives above. In this study, polyethylene glycol-grafted graphene oxide (PEG-g-GO) is synthesized by grafting PEG on the graphene oxide. The grafted PEG serves as an interfacial modifier and insulting layer in poly(vinylidene fluoride) (PVDF)/GO system. The PVDF/PEG-g-GO composites simultaneously exhibit both lower dielectric loss and higher thermal conductivity than the PVDF/GO composites. The grafted PEG on the GO surfaces can inhibit the dielectric loss through increasing the insulation capacity and free volume, as well as enhance the thermal conductivity by promoting the interfacial interaction and the GO dispersion.
Vorheriger Artikel Solvothermal reflux synthesis of NiFe2O4 nanocrystals dielectric and magnetic hyperthermia properties
Nächster Artikel Stirring-mediated anomalous dielectric behaviour of electrodeposited and in situ oxidized FeAl2O4 thin films

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Metadaten
Titel
Suppressed dielectric loss and enhanced thermal conductivity in poly(vinylidene fluoride) nanocomposites using polyethylene glycol-grafted graphene oxide
verfasst von
Wenqi Wu
Junyang Tu
Hairong Li
Ziwei Zhan
Leping Huang
Ziqing Cai
Qiong Li
Ming Jiang
Jing Huang
Publikationsdatum
21.11.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-02589-y

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