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Published in: Journal of Materials Science: Materials in Electronics 8/2019

14-03-2019

Influence of thiourea on electroless Ni–P films deposited on silicon substrates

Authors: Wangping Wu, Jianwen Liu, Naiming Miao, Jinjin Jiang, Yi Zhang, Lei Zhang, Ningyi Yuan, Qinqin Wang, Lixin Tang

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2019

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Abstract

Electroless nickel–phosphorus films were produced on silicon substrates in alkaline bath solutions, with the addition of thiourea in a concentration range of 1.0–5.0 mg L−1. The influence of thiourea on the chemical composition, morphology and corrosion resistance of the films was studied. The results revealed thiourea had a major influence on plating rate, phosphorus-content and aggregate size. The optimal content of thiourea was 1 mg L−1. Thiourea accelerated the deposition rate at low concentration of 1 mg L−1, but deceased the deposition rate and the phosphorus content at high concentration. The surface of the film without thiourea was smooth and dense. Also, with increasing thiourea content, the surface evolved into coarse nodular morphology with clear intercolonial boundaries. With the addition of 1 mg L−1 thiourea, the film had better corrosion resistance compared to film without thiourea.

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Metadata
Title
Influence of thiourea on electroless Ni–P films deposited on silicon substrates
Authors
Wangping Wu
Jianwen Liu
Naiming Miao
Jinjin Jiang
Yi Zhang
Lei Zhang
Ningyi Yuan
Qinqin Wang
Lixin Tang
Publication date
14-03-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01088-4

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