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Journal of Materials Science

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02-03-2017 | Original Paper

Micromechanical behavior of single-crystalline Cu₆Sn₅ by picoindentation

Authors: J. J. Yu, J. Y. Wu, L. J. Yu, H. W. Yang, C. R. Kao

Published in: Journal of Materials Science | Issue 12/2017

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Abstract

The micromechanical behavior of single-crystalline Cu₆Sn₅ is studied by micropillar compression in a picoindenter. The compound Cu₆Sn₅ is important because it is used as a structural material in microbumps of advanced electronic packages. Micropillars of Cu₆Sn₅ with known crystallographic orientations were fabricated by focused ion beam machining. Pillars with the c-axis perpendicular to the load direction tended to possess higher strain to failure and lower Young’s modulus. Measured Young’s modulus from micropillar compression was compared with results from nanoindentation measurements. The modulus values from micropillar compression were consistently smaller than those from nanoindentation measurements.

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Title: Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation
Authors: J. J. Yu
J. Y. Wu
L. J. Yu
H. W. Yang
C. R. Kao
Publication date: 02-03-2017
Publisher: Springer US
Published in: Journal of Materials Science / Issue 12/2017
Print ISSN: 0022-2461
Electronic ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-017-0952-6

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