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Journal of Materials Science

Erschienen in:

02.03.2017 | Original Paper

Micromechanical behavior of single-crystalline Cu₆Sn₅ by picoindentation

verfasst von: J. J. Yu, J. Y. Wu, L. J. Yu, H. W. Yang, C. R. Kao

Erschienen in: Journal of Materials Science | Ausgabe 12/2017

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Abstract

The micromechanical behavior of single-crystalline Cu₆Sn₅ is studied by micropillar compression in a picoindenter. The compound Cu₆Sn₅ is important because it is used as a structural material in microbumps of advanced electronic packages. Micropillars of Cu₆Sn₅ with known crystallographic orientations were fabricated by focused ion beam machining. Pillars with the c-axis perpendicular to the load direction tended to possess higher strain to failure and lower Young’s modulus. Measured Young’s modulus from micropillar compression was compared with results from nanoindentation measurements. The modulus values from micropillar compression were consistently smaller than those from nanoindentation measurements.

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Agarwal R, Zhang W, Limaye P, Labie R, Dimcic B, Phommahaxay A, Soussan P (2010) Cu/Sn microbumps interconnect for 3D TSV chip stacking. In: 2010 Proceedings 60th electronic components and technology conference (ECTC), 1–4 June 2010, pp 858–863. doi:10.1109/ECTC.2010.5490698

Yu A, Lau JH, Ho SW, Kumar A, Hnin WY, Yu D-Q, Jong MC, Kripesh V, Pinjala D, Kwong D-L (2009) Study of 15 μm pitch solder microbumps for 3D IC integration. In: 59th Electronic components and technology conference, 2009 (ECTC 2009), 26–29 May 2009, pp 6–10. doi:10.1109/ECTC.2009.5073988

Chen HY, Shih DY, Wei CC, Tung CH, Hsiao YL, Yu DCH, Liang YC, Chen C (2013) Generic rules to achieve bump electromigration immortality for 3D IC integration. In: 2013 IEEE 63rd electronic components and technology conference (ECTC), 28–31 May 2013, pp 49–57. doi:10.1109/ECTC.2013.6575549

Yoon SW, Ku JH, Suthiwongsunthorn N, Marimuthu PC, Carson F (2009) Fabrication and packaging of microbump interconnections for 3D TSV. In: IEEE international conference on 3D system integration, 2009 (3DIC 2009), 28–30 Sept. 2009, pp 1–5. doi:10.1109/3DIC.2009.5306554

Chuang HY, Yang TL, Kuo MS, Chen YJ, Yu JJ, Li CC, Kao CR (2012) Critical concerns in soldering reactions arising from space confinement in 3-D IC packages. IEEE Trans Device Mater Reliab 12(2):233–240. doi:10.1109/tdmr.2012.2185239 CrossRef

Yang TL, Yu JJ, Shih WL, Hsueh CH, Kao CR (2014) Effects of silver addition on Cu–Sn microjoints for chip-stacking applications. J Alloys Compd 605:193–198. doi:10.1016/j.jallcom.2014.03.165 CrossRef

Yang TL, Zhu ZX, Yu JJ, Lin YF, Kao CR (2015) Interfacial energy effect on the distribution of Ag₃Sn in full intermetallic joints. Adv Eng Mater 17(11):1528–1531. doi:10.1002/adem.201500153 CrossRef

Yang TL, Aoki T, Matsumoto K, Toriyama K, Horibe A, Mori H, Orii Y, Wu JY, Kao CR (2016) Full intermetallic joints for chip stacking by using thermal gradient bonding. Acta Mater 113:90–97. doi:10.1016/j.actamat.2016.04.046 CrossRef

Uchic MD, Dimiduk DM (2005) A methodology to investigate size scale effects in crystalline plasticity using uniaxial compression testing. Mater Sci Eng A 400–401:268–278. doi:10.1016/j.msea.2005.03.082 CrossRef

10.

Jiang L, Chawla N (2010) Mechanical properties of Cu₆Sn₅ intermetallic by micropillar compression testing. Scr Mater 63(5):480–483. doi:10.1016/j.scriptamat.2010.05.009 CrossRef

11.

Jiang L, Jiang H, Chawla N (2012) The effect of crystallographic orientation on the mechanical behavior of Cu₆Sn₅ by micropillar compression testing. J Electron Mater 41(8):2083–2088. doi:10.1007/s11664-012-2124-4 CrossRef

12.

Nogita K, Gourlay CM, McDonald SD, Wu YQ, Read J, Gu QF (2011) Kinetics of the η–η′ transformation in Cu₆Sn₅. Scr Mater 65(10):922–925. doi:10.1016/j.scriptamat.2011.07.058 CrossRef

13.

Fei H, Abraham A, Chawla N, Jiang H (2012) Evaluation of micro-pillar compression tests for accurate determination of elastic–plastic constitutive relations. J Appl Mech 79(6):061011. doi:10.1115/1.4006767 CrossRef

14.

Sneddon IN (1965) The relation between load and penetration in the axisymmetric Boussinesq problem for a punch of arbitrary profile. Int J Eng Sci 3(1):47–57. doi:10.1016/0020-7225(65)90019-4 CrossRef

15.

Zhang H, Schuster BE, Wei Q, Ramesh KT (2006) The design of accurate micro-compression experiments. Scr Mater 54(2):181–186. doi:10.1016/j.scriptamat.2005.06.043 CrossRef

16.

Wheeler JM, Michler J (2013) Elevated temperature, nano-mechanical testing in situ in the scanning electron microscope. Rev Sci Instrum 84(4):045103. doi:10.1063/1.4795829 CrossRef

17.

Simmons G, Wand H (1971) Single crystal elastic constants and calculated aggregate properties: a handbook. MIT Press, Cambridge

18.

Ghosh G (2004) Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging. J Mater Res 19(05):1439–1454. doi:10.1557/JMR.2004.0193 CrossRef

19.

Pharr GM, Oliver WC, Brotzen FR (1992) On the generality of the relationship among contact stiffness, contact area, and elastic modulus during indentation. J Mater Res 7(03):613–617. doi:10.1557/JMR.1992.0613 CrossRef

20.

Larsson AK, Stenberg L, Lidin S (1995) Crystal structure modulations in eta-Cu₅Sn₄. Z Kristallogr 210:832–837

21.

Hütsch J, Lilleodden ET (2014) The influence of focused-ion beam preparation technique on microcompression investigations: lathe vs. annular milling. Scr Mater 77:49–51. doi:10.1016/j.scriptamat.2014.01.016 CrossRef

22.

Cabarat R, Guillet L, Roux LE (1949) The elastic properties of metallic alloys. J Inst Met 75:391–402

23.

Subrahmanyam B (1972) Elastic moduli of some complicated binary alloy systems. Trans Jpn Inst Met 13(2):93–95CrossRef

24.

Ostrovskaya L, Rodin V, Kuznetsov A (1985) Elastic properties of intermetallic compounds produced by vacuum deposition. Sov J Non-Ferr Met 26(3):90–91

25.

Field RJ, Low SR 3rd, Lucey JGK (1991) Physical and mechanical of intermetallic compounds commonly found in solder joints. In: 1991 Proceedings of TMS symposium, 20–24 October 1991, pp 165–174

26.

Chromik RR, Vinci RP, Allen SL, Notis MR (2003) Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints. J Mater Res 18(09):2251–2261. doi:10.1557/JMR.2003.0314 CrossRef

27.

Deng X, Koopman M, Chawla N, Chawla KK (2004) Young’s modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation. Mater Sci Eng A 364(1–2):240–243. doi:10.1016/j.msea.2003.08.032 CrossRef

28.

Jang GY, Lee JW, Duh JG (2004) The nanoindentation characteristics of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ intermetallic compounds in the solder bump. J Electron Mater 33(10):1103–1110. doi:10.1007/s11664-004-0111-0 CrossRef

29.

Tsukamoto H, Dong Z, Huang H, Nishimura T, Nogita K (2009) Nanoindentation characterization of intermetallic compounds formed between Sn–Cu (–Ni) ball grid arrays and Cu substrates. Mater Sci Eng B 164(1):44–50. doi:10.1016/j.mseb.2009.06.013 CrossRef

30.

Lotfian S, Molina-Aldareguia JM, Yazzie KE, Llorca J, Chawla N (2013) Mechanical characterization of lead-free Sn–Ag–Cu solder joints by high-temperature nanoindentation. J Electron Mater 42(6):1085–1091. doi:10.1007/s11664-013-2517-z CrossRef

31.

Mu D, Huang H, Nogita K (2012) Anisotropic mechanical properties of Cu₆Sn₅ and (Cu, Ni)₆Sn₅. Mater Lett 86:46–49. doi:10.1016/j.matlet.2012.07.018 CrossRef

32.

Song JM, Huang BR, Liu CY, Lai YS, Chiu YT, Huang TW (2012) Nanomechanical responses of intermetallic phase at the solder joint interface—crystal orientation and metallurgical effects. Mater Sci Eng A 534:53–59. doi:10.1016/j.msea.2011.11.037 CrossRef

33.

Yang PF, Lai YS, Jian SR, Chen J, Chen RS (2008) Nanoindentation identifications of mechanical properties of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ intermetallic compounds derived by diffusion couples. Mater Sci Eng A 485(1–2):305–310. doi:10.1016/j.msea.2007.07.093 CrossRef

Titel: Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation
verfasst von: J. J. Yu
J. Y. Wu
L. J. Yu
H. W. Yang
C. R. Kao
Publikationsdatum: 02.03.2017
Verlag: Springer US
Erschienen in: Journal of Materials Science / Ausgabe 12/2017
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-017-0952-6

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